Characterization of the shear test method with low melting point In–48Sn solder joints

Kim, Jong-Woong; Jung, Seung‐Boo

doi:10.1016/j.msea.2005.02.040

Cited by 31 publications

(8 citation statements)

References 24 publications

(19 reference statements)

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“…The maximum shearing force in the force-displacement curve was defined as the shear force. 6,7 The shear force required to achieve failure decreased with increasing shear height and was maximized at the highest ram height. This implies that the resistance to plastic deformation is increased by increasing the shear strain, which could be derived from the following fundamental law:…”

Section: Resultsmentioning

confidence: 96%

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Design of Solder Joint Structure for Flip Chip Package with an Optimized Shear Test Method

Kim

Jung

2007

Journal of Elec Materi

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The structure of flip chip solder bumps was optimized in terms of shear height and shear speed using a shear test method with both experimental investigation and nonlinear, three-dimensional, finite element analysis being conducted. A representative, Pb-free solder composition, Sn-3.0Ag-0.5Cu, was used to optimize the shear test of the flip chip solder joints. Increasing the shear height, at a fixed shear speed, decreased the shear force, as did decreasing the shear speed, at a fixed shear height. These experimental and computational results supported the recommendation of low shear height and low shear speed condition for the shear testing of flip chip solder bumps. This optimized shear test method was applied to investigate the effect of various heights of mini bumps on the shear force of the solder joints. The shear force increased with increasing Ni-P mini bump height.

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Section: Resultsmentioning

confidence: 96%

“…[6][7][8] This test is very simple, time efficient, and convenient to implement. However, the test procedure has not yet been fully standardized for all uses of the ball shear test.…”

Section: Introductionmentioning

confidence: 99%

Design of Solder Joint Structure for Flip Chip Package with an Optimized Shear Test Method

Kim

Jung

2007

Journal of Elec Materi

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“…In addition to this method, a novel technique named consumable-electrode direct current arc (CDCA) has been developed to prepare Sn-based Pb-free nanoparticles, as shown in Fig.2 [16] . The principle of this equipment is to prepare both the anode and cathode by master alloy, and then the nanoparticles were obtained under the effect of the arc produced between the electrodes.…”

Section: Low Melting Solder By Element Additionmentioning

confidence: 99%

“…C.P. Wong and co-authors found that the melting point of Sn3.5Ag was achieved as low (4) bulk alloy electrodes, (5) arc discharge taking place between the electrodes, and (6) dielectric coolant [16] The melting temperature of the nanoparticles of Sn3.0Ag0.5Cu alloy prepared by CDCA technique can even be decreased to the value equivalent to that of Pb37Pb alloy [16] …”

Section: Low Melting Solders By Nanoparticle Developmentmentioning

confidence: 99%

Recent progress in the studies of low melting Sn-based Pb-free solders

Lin

Yin

Wei

2011

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging

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Limited by the toxicity of Pb and Pb-containing compounds and the implementation of the mandatory legislations, such as WEEE and RoHS, the Pb-containing solders have been banned and accordingly the Pb-free solders have become popular in electronic industry. However, the novel developed Pb-free solders could cause a series of packaging defects such as delamination, cracking, and charring etc. due to the relatively high melting temperatures of these Pb-free substitutes compared to the former Sn-Pb

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“…19 Kim and Jung, 20 investigating the plastic-strain distribution of the solder joint during the ball shear test using a computational simulation, showed that the plastic strain inside the solder ball peaked near the shear probe and decreased with an increase in the distance from the shear probe, due to the stress relaxation by the solder deformation. 19 Kim and Jung, 20 investigating the plastic-strain distribution of the solder joint during the ball shear test using a computational simulation, showed that the plastic strain inside the solder ball peaked near the shear probe and decreased with an increase in the distance from the shear probe, due to the stress relaxation by the solder deformation.…”

Section: Effect Of Multiple Reflows On Shear Properties Of Solder mentioning

confidence: 99%

Interfacial reactions and mechanical properties of In–48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows

2008

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The interfacial reactions and ball shear properties of an In–48wt%Sn solder joint with an electroplated Au/Ni ball grid array substrate were investigated with increasing numbers of reflows using scanning electron microscopy, transmission electron microscopy, energy dispersive x-ray spectrometry, inductively coupled plasma-atomic emission spectroscopy, x-ray diffractometry, and bonding testing. After one reflow, two different intermetallic compound (IMC) layers, AuIn and AuIn2, were formed at the solder–substrate interface. The AuIn was completely transformed into the AuIn2 after three reflows. The AuIn2 IMC layer broke off, and a thin continuous Ni3(SnxIn1–x)4 IMC layer was formed between the molten solder and the exposed Ni substrate after four reflows. After 10 reflows, the AuIn2 IMC layer completely spalled off the substrate and the Ni3(SnxIn1–x)4 IMC layer was dissolved into the molten solder. These interfacial reactions greatly affected the shear properties of the solder joint.

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Characterization of the shear test method with low melting point In–48Sn solder joints

Cited by 31 publications

References 24 publications

Design of Solder Joint Structure for Flip Chip Package with an Optimized Shear Test Method

Design of Solder Joint Structure for Flip Chip Package with an Optimized Shear Test Method

Recent progress in the studies of low melting Sn-based Pb-free solders

Interfacial reactions and mechanical properties of In–48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows

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