2008
DOI: 10.1016/j.polymdegradstab.2007.09.010
|View full text |Cite
|
Sign up to set email alerts
|

Improvement of thermal resistance of polydimethylsiloxanes with polymethylmethoxysiloxane as crosslinker

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

0
40
0

Year Published

2013
2013
2024
2024

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 46 publications
(43 citation statements)
references
References 18 publications
0
40
0
Order By: Relevance
“…These special performances allow silicones well suited for applications that experience large temperature swings and long service lifetimes, such as automotive engine sealants, damping material in aircraft and encapsulant for electronic devices [1]. However, polysiloxanes start to degrade around 200 8C, especially poly(dimethyl siloxane) undergoes dramatic thermal degradation above 300 8C [1,2].…”
Section: Introductionmentioning
confidence: 99%
See 4 more Smart Citations
“…These special performances allow silicones well suited for applications that experience large temperature swings and long service lifetimes, such as automotive engine sealants, damping material in aircraft and encapsulant for electronic devices [1]. However, polysiloxanes start to degrade around 200 8C, especially poly(dimethyl siloxane) undergoes dramatic thermal degradation above 300 8C [1,2].…”
Section: Introductionmentioning
confidence: 99%
“…These special performances allow silicones well suited for applications that experience large temperature swings and long service lifetimes, such as automotive engine sealants, damping material in aircraft and encapsulant for electronic devices [1]. However, polysiloxanes start to degrade around 200 8C, especially poly(dimethyl siloxane) undergoes dramatic thermal degradation above 300 8C [1,2]. Many efforts have been made to improve the high-temperature thermal stability of silicones, such as adding inorganic additive [2], increasing crosslink density [1] and incorporating rigid group (e.g., phenyl and imide heterocycle) [3,4].…”
Section: Introductionmentioning
confidence: 99%
See 3 more Smart Citations