2008 Global Symposium on Millimeter Waves 2008
DOI: 10.1109/gsmm.2008.4534546
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Improvement of Fabrication Technology for InP Gunn Devices Using Trench Method

Abstract: We have fabricated InP Gunn diodes using the improved fabrication technology in order to eliminate the problems resulting from the fabrication procedure of InP Gunn diodes for operation at 94 GHz. We see that the developed fabrication procedure using the trench method reduces the stress in InP epi-layers during alloy, and therefore the cracks in epilayers were reduced.

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Cited by 4 publications
(3 citation statements)
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References 11 publications
(13 reference statements)
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“…The epitaxial structure [10,13,14] was grown on a 2-inch, 370-µm thick, and semi-insulating (SI) InP substrate by molecular beam epitaxy (MBE). The layers were a 300nm InGaAs n+ layer doped over level of 2×10 18 cm −3 , a 1.8-µm-thick n+ InP buffer layer doped at a level of 1×10 18 cm −3 , a 1.5-µm-thick InP active layer doped with Si at 1.1×10 16 cm −3 , and a 0.3-µm-thick n+ InP contact layer doped with Si at 2×10 18 cm −3 as shown in Fig.…”
Section: Fabrication Of Inp Gunn Diodesmentioning
confidence: 99%
“…The epitaxial structure [10,13,14] was grown on a 2-inch, 370-µm thick, and semi-insulating (SI) InP substrate by molecular beam epitaxy (MBE). The layers were a 300nm InGaAs n+ layer doped over level of 2×10 18 cm −3 , a 1.8-µm-thick n+ InP buffer layer doped at a level of 1×10 18 cm −3 , a 1.5-µm-thick InP active layer doped with Si at 1.1×10 16 cm −3 , and a 0.3-µm-thick n+ InP contact layer doped with Si at 2×10 18 cm −3 as shown in Fig.…”
Section: Fabrication Of Inp Gunn Diodesmentioning
confidence: 99%
“…In the recent years, there have been numerous improvements made on the Gunn diode as a THz source device. Many studies on the fabrication of Gunn diode with different material systems such as GaAs [2] and InP [3] have been performed to utilise their unique material properties. InP has become a preferred material for the design of Gunn diode due to its high efficiency and high operating frequency [4].…”
Section: Introductionmentioning
confidence: 99%
“…Its high-frequency property coupled with wide bandwidth is valuable for highpower and high-frequency applications [3]. With the use of common materials such as GaAs [4] and InP [5], a simple device structure could produce an economical compact THz source to cater to the evolving IoT technology.…”
Section: Introductionmentioning
confidence: 99%