2000
DOI: 10.1016/s0022-3093(99)00909-6
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Improvement of a-Si:H device stability and performances by proper design of the interfaces

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Cited by 5 publications
(8 citation statements)
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“…Then the samples were flushed with diluted hydrofluoric acid (HF) to strip the covering oxide cap before loading into the vacuum deposition system. The n + , undoped and p + layers of a-Si:H were grown using Plasma Enhanced Chemical Vapor Deposition (PECVD) tool in a single run to minimize defects at the interfaces (Martins et al, 2000). Then 80 nm of ITO was sputtered on the top layer using RF sputtering tool (http://www.mvsystemsinc.com/ researchand-development-services, 2014).…”
Section: Introductionmentioning
confidence: 99%
“…Then the samples were flushed with diluted hydrofluoric acid (HF) to strip the covering oxide cap before loading into the vacuum deposition system. The n + , undoped and p + layers of a-Si:H were grown using Plasma Enhanced Chemical Vapor Deposition (PECVD) tool in a single run to minimize defects at the interfaces (Martins et al, 2000). Then 80 nm of ITO was sputtered on the top layer using RF sputtering tool (http://www.mvsystemsinc.com/ researchand-development-services, 2014).…”
Section: Introductionmentioning
confidence: 99%
“…The increasing a-SiC:H buffer-layer thickness VOC and Jsc were almost constant while the fill factor and efficiency were decreased, where we notice a slight degradation. We note that 2 nm is optimum value for a-SiC:H buffer layer thickness [13][14][15].…”
Section:  Optimizing the P/i Junctionmentioning
confidence: 81%
“…Severals studies confirmed that the solar cells performance is directly related to the absorber layer a-Si:H quality [3,24,26]. Some of these research have been studied the correlation of the mobilitylifetime product the absorber layer with solar cell properties [14,21]. In general, the optimization of absorber layer quality is based on its bandgap engineering and proprieté of material (alloys).…”
Section: Ii2 Absorber Layermentioning
confidence: 99%
“…The front TCO (SnO2) has been applied for reducing reflection loss. The back metal contact of the device was Al deposited by thermal evaporation [13,14].…”
Section: Simulation Modelmentioning
confidence: 99%