Improved CD uniformity for advanced masks using the Sigma7500 pattern generator and ProcessEqualizer

Eklund, Robert; Österberg, Anders; Hellgren, Jonas; Fosshaug, Hans; Karlin, Tord; Newman, Tom

doi:10.1117/12.736923

Cited by 3 publications

(2 citation statements)

References 15 publications

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“…Global and local loading effects, especially during plasma etching, but also to a lesser degree during develop, have recently gained increased attention in the mask community. With the ProcessEqualizer™ function 6,7 , the Sigma7500 provides a means of compensating for static process CD signatures as well as pattern-density dependent CD errors arising from mask developing and dry etching.…”

Section: Bias Functionsmentioning

confidence: 99%

Improving the CD linearity and proximity performance of photomasks written on the Sigma7500-II DUV laser writer through embedded OPC

et al. 2007

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Optical proximity correction (OPC) is widely used in wafer lithography to produce a printed image that best matches the design intent while optimizing CD control. OPC software applies corrections to the mask pattern data, but in general it does not compensate for the mask writer and mask process characteristics. The Sigma7500-II deep-UV laser mask writer projects the image of a programmable spatial light modulator (SLM) using partially coherent optics similar to wafer steppers, and the optical proximity effects of the mask writer are in principle correctable with established OPC methods.To enhance mask patterning, an embedded OPC function, LinearityEqualizer™, has been developed for the Sigma7500-II that is transparent to the user and which does not degrade mask throughput. It employs a Calibre™ rule-based OPC engine from Mentor Graphics, selected for the computational speed necessary for mask run-time execution. A multinode cluster computer applies optimized table-based CD corrections to polygonized pattern data that is then fractured into an internal writer format for subsequent data processing. This embedded proximity correction flattens the linearity behavior for all linewidths and pitches, which targets to improve the CD uniformity on production photomasks.Printing results show that the CD linearity is reduced to below 5 nm for linewidths down to 200 nm, both for clear and dark and for isolated and dense features, and that sub-resolution assist features (SRAF) are reliably printed down to 120 nm. This reduction of proximity effects for main mask features and the extension of the practical resolution for SRAFs expands the application space of DUV laser mask writing.

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Section: Bias Functionsmentioning

confidence: 99%

Improving the CD linearity and proximity performance of photomasks written on the Sigma7500-II DUV laser writer through embedded OPC

et al. 2007

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“…Recently, MEMS micromachining also initiated a pioneering approach to create programmable diffractive optical elements on the basis of micromechanical mirror arrays (MMAs). Two successful MMA actuator principles emerged in different fields of application -piston mirror arrays for adaptive optics [3], and torsion mirror arrays for deep UV microlithography [4,5]. They are examples of flexible diffractive components.…”

Section: Introductionmentioning

confidence: 99%

Technology development of diffractive micromirror arrays for the deep ultraviolet to the near infrared spectral range

et al. 2010

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A new generation of micromirror arrays (MMAs) with torsional actuators is being developed within the European research project MEMI in order to extend the usable spectral range of diffractive MMAs from deep ultraviolet into the visible and near infrared. The MMAs have 256 x 256 pixels reaching deflections above 350 nm at a frame rate of 1 kHz, which enables an operation in the target wavelength range between 240 nm and 800 nm. Customized driver electronics facilitates computer controlled operation and simple integration of the MMA into various optical setups. Tests in the visible wavelength range demonstrate the functionality and the high application potential of first MMA test samples

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Mask and wafer evaluation of Sigma7500 pattern generator applied to 65nm logic metal and via layers

Liu

Shi

et al. 2009

SPIE Proceedings

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Improved CD uniformity for advanced masks using the Sigma7500 pattern generator and ProcessEqualizer

Cited by 3 publications

References 15 publications

Improving the CD linearity and proximity performance of photomasks written on the Sigma7500-II DUV laser writer through embedded OPC

Improving the CD linearity and proximity performance of photomasks written on the Sigma7500-II DUV laser writer through embedded OPC

Technology development of diffractive micromirror arrays for the deep ultraviolet to the near infrared spectral range

Mask and wafer evaluation of Sigma7500 pattern generator applied to 65nm logic metal and via layers

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