Implications of interconnection theory for optical digital computing

Özaktaş, Haldun M.; Goodman, Joseph W.

doi:10.1364/ao.31.005559

Cited by 17 publications

(6 citation statements)

References 23 publications

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“…Another application of Rent's rule tries to assess the merits of new chip or computer architectures before they have to be built, using wire length estimates based on Rent's rule and a generic model for the architecture. This research has gained attention especially due to the possibilities of using optical interconnections to build three-dimensional chips [16], [17], [18], [19], [20]. Finally, Rent's rule has also been used to generate synthetic circuit benchmarks [21], [22].…”

Section: Application Of Rent's Rulementioning

confidence: 99%

The interpretation and application of Rent's rule

Christie

Stroobandt

2000

IEEE Trans. VLSI Syst.

222

178

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This paper provides a review of both Rent's rule and the placement models derived from it. It is proposed that the power-law form of Rent's rule, which predicts the number of terminals required by a group of gates for communication with the rest of the circuit, is a consequence of a statistically homogeneous circuit topology and gate placement. The term "homogeneous" is used to imply that quantities such as the average wire length per gate and the average number of terminals per gate are independent of the position within the circuit. Rent's rule is used to derive a variety of net length distribution models and the approach adopted in this paper is to factor the distribution function into the product of an occupancy probability distribution and a function which represents the number of valid net placement sites. This approach places diverse placement models under a common framework and allows the errors introduced by the modeling process to be isolated and evaluated. Models for both planar and hierarchical gate placement are presented.

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Section: Application Of Rent's Rulementioning

confidence: 99%

The interpretation and application of Rent's rule

Christie

Stroobandt

2000

IEEE Trans. VLSI Syst.

222

178

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“…The model used for this purpose in the existing literature is a cube containing only elementary circuit elements, wires or optical fibers, and coolant paths, with other details of packaging being stripped, Ozaktas and Goodman [41,42] used such models to estimate the advantage of optical interconnections as compared with metal wire interconnections, and discussed the optimum combination of optical and metal interconnections in systems involving lO^-lO'^ elementary circuits. Direct-water-cooling could be attractive but remain to be elusive as to its commercial applications.…”

Section: Liquid-cooled Three-dimensional Systemsmentioning

confidence: 99%

Heat in Computers: Applied Heat Transfer in Information Technology

Nakayama¹

2013

Journal of Heat Transfer

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Since the advent of modern electronics technology, heat transfer science and engineering has served in the development of computer technology. The computer as an object of heat transfer research has a unique aspect; it undergoes morphological transitions and diversifications in step with the progress of microelectronics technology. Evolution of computer's hardware manifests itself in increasing packing density of electronic circuits, modularization of circuit assemblies, and increasing hierarchical levels of system internal structures. These features are produced by the confluence of various factors; the primary factors are the pursuit of ever higher processing performance, less spatial occupancy, and higher energy utilization efficiency. The cost constraint on manufacturing also plays a crucial role in the evolution of computer's hardware. Besides, the drive to make computers ubiquitous parts of our society generates diverse computational devices. Concomitant developments in heat generation density and heat transfer paths pose fresh challenges to thermal management. In an introductoiy part of the paper, I recollect our experiences in the mainframe computers of the 1980s, where the system's morphological transition allowed the adoption of water cooling. Then, generic interpretations of the hardware evolution are attempted, which include recapturing the past experience. Projection of the evolutionary trend points to shrinking space for coolant flow, the process commonly in progress in all classes of computers today. The demand for compact packaging will rise to an extreme level in supercomputers, and present the need to refocus our research on microchannel cooling. Increasing complexity of coolant flow paths in small equipment poses a challenge to a user of computational fluid dynamics (CFD) simulation code. In highly integrated circuits the paths of electric current and heat become coupled, and coupled paths make the electricallthermal codesign an extremely challenging task. These issues are illustrated using the examples of a consumer product, a printed circuit board (PCB), and a many-core processor chip.

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“…Since that time, a body of work (see, for example, [4] and [6]- [33]) has addressed potential benefits and limits of optics for interconnection [4], [7], [8], [12], [14]- [16], [20], [23], [24], [28], analysis of the relative benefits of optics versus electronics [4], [6], [9]- [11], [13], [21], [22], [26], [27], [30], [31], [33], and comparison of different kinds of optical approaches against one another [17]- [19], [25], [29]. Several of these papers review parts of this work (e.g., [20], [22], [27], and [28]).…”

Section: A Historical Backgroundmentioning

confidence: 99%