Implementation of SOI diode uncooled IRFPA in TEC-less and shutter-less operation

Fujisawa, Daisuke; Kosasayama, Yasuhiro; Takikawa, Takao; Hata, Hiroyuki; Takenaga, Takashi; Satake, Tetsuya; Yamashita, K.; Suzuki, Daisuke

doi:10.1117/12.2305165

Cited by 5 publications

(7 citation statements)

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“…These applications are often size constrained, while requiring high energy efficiency and stability [1][2][3][4]. With the advantages of low cost, small size, and good uniformity, uncooled infrared focal plane arrays (IRFPA) can be applied in IoT applications, such as composition analysis, smart monitoring, and spectral analysis [5][6][7][8][9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

A Low Power ROIC with Extended Counting ADC Based on Circuit Noise Analysis for Sensor Arrays in IoT System

Zhou

et al. 2022

Journal of Sensors

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As the Internet of Things (IoT) is rapidly integrated into our daily life, the demand for high performance readout integrated circuit (ROIC) design for sensor arrays is boosting. This paper presents a low power, low noise ROIC with 14-bit column-parallel extended counting (EC) ADCs for sensor arrays targeting the IoT applications. The proposed EC-ADC adopts a pseudodifferential architecture to cancel even-order nonlinearity. The analog front-end is a G m stage, which employs a current-reuse topology to boost the transconductance and reduce noise without increasing current consumption. The upper 9-bit conversion is implemented during integration, and the residual voltage is converted by a 5-bit single-slope (SS) ADC, where the comparator is reused. A ping-pong integrator is proposed to reduce the reset time and improve linearity, eliminating the power-hungry CTIA structure. The ROIC is designed in 0.18 μm 1P5M CMOS process for a 640 × 480 sensor array. Power consumption of the ROIC is 33 mW, and each column ADC consumes 40.1 μW. Simulation results show an input-referred noise of 0.89 LSB (1.74 μVrms), an integral nonlinearity of +0.92/-0.70 LSB, an ENOB of 12.87 bits, and a FoM of 131.1 fJ/step.

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Section: Introductionmentioning

confidence: 99%

A Low Power ROIC with Extended Counting ADC Based on Circuit Noise Analysis for Sensor Arrays in IoT System

Zhou

et al. 2022

Journal of Sensors

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“…The design of the ROC significantly affects the power dissipation and the quality of the analog output signal before converting. The most commonly used ROC configuration in microbolometer IRFPAs are direct injection (DI) [ 61 , 84 , 85 ], gate modulation input (GMI) [ 13 , 34 , 35 ], and capacitive transimpedance amplifier (CTIA) [ 20 , 31 , 65 , 86 , 87 ]. The design concepts involve the performance and the structural complexity; each designer may prefer a different design depending on the technical requirement and the process schedule.…”

Section: Read-out Integrated Circuit (Roic)mentioning

confidence: 99%

“… Trends of the pixel size reduction for complementary metal oxide semiconductor (CMOS)-compatible microbolometer infrared (IR) detectors, data taken from (in left-to-right order) [ 12 , 13 , 14 , 15 , 17 , 18 , 19 , 20 , 21 , 22 , 25 , 27 , 28 , 29 , 31 , 32 , 33 , 34 , 35 , 37 , 39 , 40 , 41 , 43 , 46 ]. …”

Section: Figurementioning

confidence: 99%

“…The reason is that the thermal IR detectors are considered to be much slower and less insensitive than the photon IR detectors [ 6 ]. In 1992, both Texas Instruments and Honeywell published their uncooled IRFPAs (infrared focal plane array) based on pyroelectric type and microbolometer type thermal detector, respectively, with fascinating performance [ 10 , 11 ], successfully encouraging a sustained effort to further reduce the pixel size, improve the device performance, and reduce the production cost [ 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 , 20 , 21 , 22 , 23 , 24 , 25 , 26 , 27 , 28 , 29 , 30 , 31 , 32 , 33 , 34 , 35 , 36 , 37 , 38 , 39 , 40 , 41 , 42 , 43 , 44 , 45 , 46 ].…”

Section: Introductionmentioning

confidence: 99%

“…Comparing to other thermal IR detectors like thermopile detector [ 47 , 48 , 49 , 50 ], pyroelectric detector [ 51 , 52 , 53 , 54 ], and superconducting transition edge sensor (TES) bolometer detector [ 55 , 56 , 57 , 58 ], it is promising for the commercial imaging applications because of its respectable performance, small pixel size, and ease to make [ 59 ]. Attributing to the continuous efforts and the technological advances, the pixel size of the microbolometer detector fabricated via the low-cost manufacture technology based on silicon LSI (large scale integration) circuit process has been reduced to beyond 17 μm [ 18 , 19 , 20 ]. Not only does the high-integration process lower the production cost of the detectors, but also it provides mature approach with small feature size and high uniformity to benefit the pixel size and the device performance.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Low-Cost Microbolometer Type Infrared Detectors

Guo

Zhu

et al. 2020

Micromachines

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The complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications. The fabrication of the CMOS-compatible microbolometer infrared focal plane arrays (IRFPAs) is based on the combination of the standard CMOS process and simple post-CMOS micro-electro-mechanical system (MEMS) process. With the technological development, the performance of the commercialized CMOS-compatible microbolometers shows only a small gap with that of the mainstream ones. This paper reviews the basics and recent advances of the CMOS-compatible microbolometer IRFPAs in the aspects of the pixel structure, the read-out integrated circuit (ROIC), the focal plane array, and the vacuum packaging.

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Silicon Diode Uncooled FPA With Three-Dimensional Integrated CMOS Readout Circuits

et al. 2019

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Implementation of SOI diode uncooled IRFPA in TEC-less and shutter-less operation

Cited by 5 publications

References 0 publications

A Low Power ROIC with Extended Counting ADC Based on Circuit Noise Analysis for Sensor Arrays in IoT System

A Low Power ROIC with Extended Counting ADC Based on Circuit Noise Analysis for Sensor Arrays in IoT System

Low-Cost Microbolometer Type Infrared Detectors

Silicon Diode Uncooled FPA With Three-Dimensional Integrated CMOS Readout Circuits

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