Implementation of and extensions to Darveaux's approach to finite-element simulation of BGA solder joint reliability

Abstract

Viscoplastic finite-element (FE) simulation is used to predict board-level solder joint reliability of ball grid array (BGA) packages under accelerated temperature cycling (ATC) conditions. The model is first validated against archived ATC data, then parametric studies are conducted to examine the model's sensitivity to changes in design factors and thenno-mechanical material properties. The use of the program Surface Evolver to predict BGA solder joint shape and profile is briefly discussed.

Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA

“…The position of critical solder ball may shift with die size, because the distribution of stress induced by die edge is changed. When top and bottom dice sizes have the same length, larger die sizes of 5 · 5 mm is better than 3 · 3 mm, because the SED is more uniformly distributed in (2,2) and (4,4) balls. For 5 · 5 mm dice sizes, outermost (5,5) ball (see Fig.…”

“…Critical solder ball is one of (2, 2), (4,4), and (5, 5) balls, which has the lowest fatigue life. These critical solder balls are located at the diagonal solder ball layout (see Fig.…”

“…The critical solder ball of stacked die BGA studied is at (4,4), between 3.6 · 3.5 mm top die and 5 · 5 bottom die (see Fig. 6, quarter model), and the failure interface is along the top solder/pad interface (see Fig.…”

“…However, the process of thermal cycling test is time-consuming and costly. Therefore, FEA modeling [2][3][4][5][6][7][8][9][10][11][12][13] is widely used as an analysis tool for solder joint reliability, especially during the design stage of new package. There are many approaches used by researchers [14] in the modeling of fatigue life, e.g., stress-based, plastic/creep-based, energy-based, and damage accumulation-based.…”

Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages

“…Depending on the mechanical quantities used, solder fatigue life models can be categorized as strain-based, stress-based, plastic work-based or stress intensity factor-based. Among them, plastic work based-models seem to received the largest attention in the literature, and therefore is the model of choice in this paper [8][9][10][11][12][13][14][15][16]. This model attributes plastic work accumulation per cycle as the principal damage indicator and uses the power law to establish the relationship between crack propagation rate and the damage indicator.…”