2020
DOI: 10.1109/tcsi.2020.2990672
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Impact of Variability on Processor Performance in Negative Capacitance FinFET Technology

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Cited by 49 publications
(18 citation statements)
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“…(1) Process Variation Effects: First, we would like to mention that even through the presented analysis in this manuscript is only for the MADD circuit (which is a digital circuit), the characterized NCFET-aware cell library contains a wide range of different standard cell types. In [34], we investigated the impact of various sources of variability on the NCFET transistor compared to the baseline transistor. In addition, the impact of variability effects on the delay of all standard cells is also studied for both baseline and NCFET cells.…”
Section: Ncfet Reliability Discussionmentioning
confidence: 99%
“…(1) Process Variation Effects: First, we would like to mention that even through the presented analysis in this manuscript is only for the MADD circuit (which is a digital circuit), the characterized NCFET-aware cell library contains a wide range of different standard cell types. In [34], we investigated the impact of various sources of variability on the NCFET transistor compared to the baseline transistor. In addition, the impact of variability effects on the delay of all standard cells is also studied for both baseline and NCFET cells.…”
Section: Ncfet Reliability Discussionmentioning
confidence: 99%
“…The simulation also shows that ∆T C (SHE) decreases with V dd decreases and reaches ≈50 • C at 0.5V for 3-fins and ≈120 • C for 7-fins. Please note that this high temperature is enclosed within transistor's channel while the chip temperature is still relatively cool and that silicon can cope with these temperatures [30] and suffer only from electrical degradations. reliability issues [13]…”
Section: Impact Of Self Heating On Transistorsmentioning
confidence: 99%
“…To demonstrate such variation, we simulate 1000 different nFinFET and 1000 different pFinFET transistors (i.e., different length, width, etc) using HSPICE. The actual variability data are taken from [30], [31] for Intel 14nm FinFET technology. We study the variations for T C high and low for a large range of voltages [0.2V-0.7V] with 10mV steps (see Algorithm 1).…”
Section: Appendix B Ztc Of Transistors Under Process Variationsmentioning
confidence: 99%
“…One of the main process challenges is the integration of ferroelectric material in the gate stack with a high quality interface with the silicon. An inflection point occurred in 2012, after the discovery of ferroelectricity in HfO 2 based materials, which made the NCFET technology compatible with the standard CMOS technology process [20]- [22]. Subsequently, several experimental works have demonstrated NCFETs with HfO 2 [19] and steep sub-threshold slope, NC-FinFET shows an increased complexity in its behavior compared to conventional FinFET.…”
Section: B Negative Capacitance Finfetmentioning
confidence: 99%
“…A compact model [6] based on BSIM-CMG is used for emerging NC-FinFET. Details on the used NC-FinFET modeling and FinFET device calibration with industrial measurements are available in [20] and [21], respectively.…”
Section: A Experimental Setupmentioning
confidence: 99%