It is generally known that a layer of amorphous silicon oxide (SiO 2 ) naturally exists on the surface of silicon, resulting in the growth of gallium oxide (Ga 2 O 3 ) that is no longer affected by substrate crystallinity during sputtering. This work highlights the formation energy between the native amorphous nano-oxide film formed on the Si substrate and monoclinic β-Ga 2 O 3 dominating the preferred orientation prepared for deep ultraviolet photodetectors. The latter were deposited on p-type silicon (p-Si) with (111) orientation using radio frequency sputtering at 600 °C and post rapid thermal annealing (RTA). The X-ray diffraction (XRD) results indicate both as-deposited and postannealing films with the (400) preferred orientation for a layer thickness of 100 nm. However, slight random orientation with the amorphous structure is mixed in the preferred one for the asdeposited film with a thickness of 200 nm and reduced after being annealed at 800 °C, which is observed by XRD and transmission electron microscopy. Meanwhile, thermal-induced massive twin boundaries (TBs) and stacking faults (SFs) were generated when annealed at 1000 °C, owing to the relaxation of lattice strain by the coherent interface. The interfacial bonding energy per unit area (E i ) between β-Ga 2 O 3 films with various facets ((001), ( 010), (100), and (2̅ 01)) and amorphous SiO 2 was calculated using density functional theory. The E i of β-Ga 2 O 3 (100)/SiO 2 reveals the highest value (0.289 eV/Å 2 ), which is consistent with the (100) preferred orientation of deposited films. The (100) preferred orientation is the driving force for TBs and SFs. The discrimination of responsivities and the photo/dark current contrast ratio (I ph /I dark ) are inversely proportional to the amorphous structure, grain boundaries, TBs, and SFs. Therefore, optimum metal−semiconductor−metal photodetector performance is achieved for RTAtreated samples at 800 °C with an I ph /I dark of 3.91 × 10 2 and a responsivity of 0.702 A/W (λ peak = 230 nm) at 5 V bias for a 200 nm thin film.