2007
DOI: 10.1016/j.mee.2007.05.024
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Impact of the Cu-based substrates and catalyst deposition techniques on carbon nanotube growth at low temperature by PECVD

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Cited by 20 publications
(10 citation statements)
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“…Normally, controlling the CNT structure and its growth is achieved through a series of experimental parameters such as process temperature, gas mixtures, pressure, flow rates, and catalytic materials used. Even for CVD methods, there are various different approaches, including general thermal CVD, floating catalyst CVD (FC‐CVD), aerosol‐assisted CVD (AA‐CVD), plasma‐enhanced CVD (PE‐CVD), and DC (direct current) plasma‐enhanced CVD (DC‐PEVCD) …”
Section: Synthesis and Characterization Of Nanomaterialsmentioning
confidence: 99%
“…Normally, controlling the CNT structure and its growth is achieved through a series of experimental parameters such as process temperature, gas mixtures, pressure, flow rates, and catalytic materials used. Even for CVD methods, there are various different approaches, including general thermal CVD, floating catalyst CVD (FC‐CVD), aerosol‐assisted CVD (AA‐CVD), plasma‐enhanced CVD (PE‐CVD), and DC (direct current) plasma‐enhanced CVD (DC‐PEVCD) …”
Section: Synthesis and Characterization Of Nanomaterialsmentioning
confidence: 99%
“…Numerous investigators have reported CNTs, its development of commercial applications such as scanning probes [2], field emission display (FED) [3], anode for lithium ion batteries [4], nanoelectronic devices [5], supercapacitors [6], molecular sensors [7], and hydrogen storages [8] have been stimulated tremendously. Several methods, including arc-discharge [9], chemical vapor deposition (CVD) with [10][11][12] or without plasma enhancement [13,14], and laser ablation [15], have been used for the growth of CNTs in the presence of the catalyst. For CVD process, CNTs can directly grow on the predefined catalyst layer, and have high yield and uniformity [16].…”
Section: Introductionmentioning
confidence: 99%
“…It is known that both Ni and Cu are active metals and can diffuse between each other at relative high temperature, which will poison the activity of Ni [15,16]. In this work, we introduced Ce as an additive to successfully prevent the reaction between Cu and Ni.…”
Section: Resultsmentioning
confidence: 99%