2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Sys 2007
DOI: 10.1109/esime.2007.359956
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Impact of Solder Overflow and ACLV Moisture Absorption of Mold Compound on Package Reliability

Richard Qian1,
Yong Liu
2
,
S. Irving
3
et al.
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Power Packaging Typical Reliability and Test

Liu
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2011
Power Electronic Packaging
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Power Packaging Typical Reliability and Test

Liu
1
2011
Power Electronic Packaging
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A Direct Multi-Field Coupling Methodology for Modeling Moisture-Induced Stresses and Delamination in Electronic Packages

Chen
1
,
Fan
2
,
Liu
3
2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Thermal mechanical modeling and assessment for a novel power system module with vertical input capacitor

Qian
1
,
Liu
2
,
Liu
3
et al. 2011
2011 12th Intl. Conf. On Thermal, Mechanical &Amp; Multi-Physics Simulation and Experiments in Microelectronics and Microsystem
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