Impact of microfluidic cooling on high power amplifier RF performance

Ditri, John J.; Cadotte, Roland; Fetterolf, David; McNulty, Michael

doi:10.1109/itherm.2016.7517726

Cited by 9 publications

(3 citation statements)

References 4 publications

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“…As power electronics increasingly need pumped fluid cooling and drive electronics are increasingly integrated into motors, the symbiosis between high heat flux electronics and high-power density motors is increasing. Further, with wide bandgap semiconductors, the need for pumped single-and two-phase cooling for logic and power devices is increasing [40,41]. As well, at the same time, logic and power devices are increasingly integrated with electric machines [38].…”

Section: Lessons From High-performance Electronicsmentioning

confidence: 99%

Thermal Management of High-Power Density Electric Motors for Electrification of Aviation and Beyond

Deisenroth

Ohadi

2019

Energies

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Enhanced cooling, coupled with novel designs and packaging of semiconductors, has revolutionized communications, computing, lighting, and electric power conversion. It is time for a similar revolution that will unleash the potential of electrified propulsion technologies to drive improvements in fuel-to-propulsion efficiency, emission reduction, and increased power and torque densities for aviation and beyond. High efficiency and high specific power (kW/kg) electric motors are a key enabler for future electrification of aviation. To improve cooling of emerging synchronous machines, and to realize performance and cost metrics of next-generation electric motors, electromagnetic and thermomechanical co-design can be enabled by innovative design topologies, materials, and manufacturing techniques. This paper focuses on the most recent progress in thermal management of electric motors with particular focus on electric motors of significance to aviation propulsion.

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Section: Lessons From High-performance Electronicsmentioning

confidence: 99%

Thermal Management of High-Power Density Electric Motors for Electrification of Aviation and Beyond

Deisenroth

Ohadi

2019

Energies

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“…However, the actual power density is currently only 4–5 W/mm [ 6 , 7 ] due to the limitation in cooling capacity. Particularly, the hotspot generated by the accumulation of heat in the near-junction region leads to serious degradation, for example, in gain, output power, and power-added efficiency [ 8 , 9 ], limiting the performance of high-power output. Therefore, cooling technology has become the key to further enhancing the performance of AlGaN/GaN HEMT devices.…”

Section: Introductionmentioning

confidence: 99%

Comparison of Different Cooling Schemes for AlGaN/GaN High-Electron Mobility Transistors

Song,

Chen,

Wang

et al. 2023

Micromachines

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Cooling is important for AlGaN/GaN high-electron mobility transistors (HEMTs) performance. In this paper, the advantages and disadvantages of the cooling performance of three cooling schemes: remote cooling (R-cool), near-chip cooling (NC-cool), and chip-embedded cooling (CE-cool) are compared. The influences of distinct geometric parameters and operating conditions on thermal resistance are investigated. The results show that the thermal resistances of NC-cool and CE-cool are almost the same as each other. Decreasing microchannel base thickness (hb) significantly increases the thermal resistance of CE-cool, and when its thickness is less than a critical value, NC-cool exhibits superior cooling performance than CE-cool. The critical thickness increases when decreasing the heat source pitch (Ph) and the convective heat transfer coefficient (hconv) or increasing the thermal conductivity of the substrate (λsub). Moreover, increasing Ph or λsub significantly improves the thermal resistance of three cooling schemes. Increasing hconv significantly decreases the thermal resistances of NC-cool and CE-cool while hardly affecting the thermal resistance of R-cool. The influence of the boundary thermal resistance (TBR) on the thermal resistance significantly increases at higher λsub and larger hconv.

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“…However, such electronics are no less sensitive to temperature on their performance. [16] demonstrated the significant improvement in performance such cooling can provide for high power RF amplifiers. [17] presented an application of microfluidics for both cooling of an RF amplifier, and tuning of its operating frequency.…”

Section: Introductionmentioning

confidence: 99%

3D Printed Integrated Microfluidic Cooling for High Power RF Applications

Craton

Ghazali

Wright

et al. 2017

International Symposium on Microelectronics

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This paper presents the design and fabrication of microfluidic channel integration in a plastic substrate using 3D printing. The microfluidic channels are integrated along with a copper plate which the coolant is in direct contact with. To demonstrate the design, a diode intended for switched power supplies is integrated onto the copper plate and its performance characterized. 3D printing or additive manufacturing (AM) allows for fast prototyping of such package designs and can be readily adopted in the fabrication of RF circuits. This paper, to the best of our knowledge, for the first time will demonstrate a 3D printed integrated microfluidic channel for the cooling of electronic circuits. Details of design, fabrication and characterization are presented.

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Impact of microfluidic cooling on high power amplifier RF performance

Cited by 9 publications

References 4 publications

Thermal Management of High-Power Density Electric Motors for Electrification of Aviation and Beyond

Thermal Management of High-Power Density Electric Motors for Electrification of Aviation and Beyond

Comparison of Different Cooling Schemes for AlGaN/GaN High-Electron Mobility Transistors

3D Printed Integrated Microfluidic Cooling for High Power RF Applications

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