3D Printed Integrated Microfluidic Cooling for High Power RF Applications

Abstract

This paper presents the design and fabrication of microfluidic channel integration in a plastic substrate using 3D printing. The microfluidic channels are integrated along with a copper plate which the coolant is in direct contact with. To demonstrate the design, a diode intended for switched power supplies is integrated onto the copper plate and its performance characterized. 3D printing or additive manufacturing (AM) allows for fast prototyping of such package designs and can be readily adopted in the fabrication of RF circuits. This paper, to the best of our knowledge, for the first time will demonstrate a 3D printed integrated microfluidic channel for the cooling of electronic circuits. Details of design, fabrication and characterization are presented.

Low-Cost Microwave Components’ Fabrication in Hybrid Technology of Laminates and Additive Manufacturing on an Example of Miniaturized Suspended Directional Coupler

“…On top of that, a large area format available with multi-layer printed circuit boards (PCBs) is available. Finally, solutions such as integrated cooling of active parts [27] for efficiency improvement due to the use of 3D printing, or patterned metal layer when proper masking technique is used before PVD coating are possible as well.…”