The Principles of "Smart" Encapsulation: Using Additive Printing Technology for the Realization of Intelligent Application-Specific Packages for IoT, 5G, and Automotive Radar Applications

Tehrani, Bijan; Bahr, Ryan; Revier, Daniel; Cook, Benjamin S.; Tentzeris, Manos M.

doi:10.1109/ectc.2018.00025

Cited by 11 publications

(2 citation statements)

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“…Additive manufacturing processes allow more flexible shapes and properties of molding, which could add functionality, performance improvement, and cost advantages that conventional injection and transfer molding could not offer. [ 286,287 ] Similarly, printing technologies allow more flexibility and performance improvement in interconnect such as wire‐bonding and metal‐bump. [ 288 ] Using inkjet‐printed adhesion promoters, precise control over the die‐attachment process and other aspects of leadframe performance ( Figure ) can potentially be other applications of the printing process to minimize the impact of package stress on the die‐delamination.…”

Section: Applicationsmentioning

confidence: 99%

Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems

Zikulnig

Chang

Bito³

et al. 2023

Advanced Sensor Research

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Requirements for the miniaturization of electronics are constantly increasing as more and more functions are aimed to be integrated into a single device. At the same time, there are strong demands for low-cost manufacturing, environmental compatibility, rapid prototyping, and small-scale productions due to fierce competition, policies, rapid technical progress, and short innovation times. Altogether, those challenges cannot be sufficiently addressed by simply using either printed or silicon electronics. Instead, the synergies from combining those two technologies into so-called hybrid electronics create novel opportunities for advanced capabilities and new areas of applications. In the first part of this review, printing and patterning technologies are presented with potential compatibility with conventional electronics manufacturing techniques. They can be utilized for the fabrication of highly complex structures. Nonetheless, up-scalability, integration, and adaptation for industrial fabrication remain challenging due to technically limiting factors. Consequently, a special focus is placed on the up-scalability, availability of commercial printing, and manufacturing machines, as well as processing challenges for high-volume industrial applications. The second part of this review further provides an overview of exciting and innovative application possibilities of printed electronics, emphasizing sensor applications, as well as additively manufactured integrated circuits.

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Section: Applicationsmentioning

confidence: 99%

Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems

Zikulnig

Chang

Bito³

et al. 2023

Advanced Sensor Research

View full text Add to dashboard Cite

show abstract

“…Printing can occur on arbitrary substrates, enabling thin flexible designs on thin flexible conformal substrates to conformally jetted onto large 3-D printed parts, such as 3-D printed semiconductor packaging for system on/in package integration (see Fig. 12) [93], [94]. With the use of heterogeneous integration, low-loss transmissionline-based interconnects, transistors, and passives can be integrated to achieve highly integrated microwave architectures, including transceivers, backscatter communication, and EH [95], [98].…”

Section: (A) Rf-powered Passive Backscatter Sensing Node Schematic Including An Rf-to-dc Converter a Backscattering Modulator An Activatimentioning

confidence: 99%