Impact of intermetallic compound on solder bump electromigration reliability

Abstract

Solder bumps are important interconnect components for 3D integration. Their mechanical and electrical properties influence the overall reliability of 3D ICs. A characteristic of solder bumps is that during technology processing and usage their material composition changes. This compositional transformation influences the operation of 3D ICs and, in connection with electromigration, may cause failures in ICs. In this paper we present a model for describing the growth of intermetallic compound inside a solder bump under the influence of electromigration. Simulation results based on the new model are discussed in conjunction with corresponding experimental findings.