Impact of inter-metallic compound thickness on thermo-mechanical reliability of solder joints in solar cell assembly

Zarmai, M.T; Oduoza, Chike F.

doi:10.1016/j.microrel.2020.114008

Cited by 12 publications

(10 citation statements)

References 8 publications

(15 reference statements)

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“…For RESs, other effective factors, such as intermetallic compound (IMC) thickness, are also studied in the available solar panels' reliability analysis problems (Zarmai and Oduoza, 2021). Also, for the wind turbines, one of the first things that is considered when studying their reliability is the random variables involved in the related models.…”

Section: Wind Turbine Electricity Power Formulationmentioning

confidence: 99%

Introducing a new system performance function to formulate reliability analysis problems of wind turbines

Artin

2023

Wind Engineering

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Consideration of safety is one of the current requirements to design a new system that is often implemented by defining the system failure probability. Renewable energy systems (RESs) do have the same requirements when it comes to safety and reliability. When designing a wind turbine, as a RES, its reliability is of the highest importance. So, efficient reliability models are required to ensure the turbine is working safely to generate electricity. A new model is introduced in this paper by taking into account the wind speed and the wind angle as two effective factors. These two random variables are reported to follow the Gaussian and Weibull probability distributions, and so are employed to define a limit-state function for the turbines. This limit-state function, which is also called system performance function, will then be used to find out the system failure probability.

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Section: Wind Turbine Electricity Power Formulationmentioning

confidence: 99%

Introducing a new system performance function to formulate reliability analysis problems of wind turbines

Artin

2023

Wind Engineering

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“…To provide some instances, Samavatian et al [13] found that the extra effects of creep on the fatigue mechanism led to the accelerated damage of solder joints in power semiconductors. Zarmai et al [14] reported that the increase in the intermetallic compounds (IMCs) thickness deteriorated the mechanical properties of solder joints and diminished the thermo-mechanical reliability of crystalline silicon solar cell assemblies. Based on a profile-based reliability assessment, Jabarullah et al [15] unveiled that the solder joint failure was initiated with the IMC growth and followed by the appearance of voids in the microstructure.…”

Section: Introductionmentioning

confidence: 99%

Expectation–maximization machine learning model for micromechanical evaluation of thermally-cycled solder joints in a semiconductor

Chen

2023

J. Phys.: Condens. Matter

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This paper aims to study the microstructural and micromechanical variations of solder joints in a semiconductor under the evolution of thermal-cycling loading. For this purpose, a model was developed on the basis of expectation-maximization machine learning (ML) and nanoindentation mapping. Using this model, it is possible to predict and interpret the microstructural features of solder joints through the micromechanical variations (i.e. elastic modulus) of interconnection. According to the results, the classification of Sn-based matrix, intermetallic compounds and the grain boundaries with specified elastic-modulus ranges was successfully performed through the ML model. However, it was detected some overestimations in regression process when the interfacial regions got thickened in the microstructure. The ML outcomes also revealed that the thermal-cycling evolution was accompanied with stiffening and growth of intermetallic compounds; while the spatial portion of Sn-based matrix decreased in the microstructure. It was also figured out that the stiffness gradient becomes intensified in the treated samples, which is consistent with this fact that the thermal cycling increases the mechanical mismatch between the matrix and the intermetallic compounds.

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“…In a printed circuit board assembly (PCBA), all solder joints must provide the level of structural and electronic reliability required for the application (Vianco, 2017). Many factors affect the reliability of solder joints (Zarmai, 2021; Arabi, 2020). Most electronic failures that occur in devices are because of thermomechanical fatigue, a form of low-cycle fatigue (Vianco, 2017).…”

Section: Introductionmentioning

confidence: 99%

Effect of the IMC layer geometry on a solder joint thermomechanical behavior

Capela

Souza

Costa

et al. 2022

SSMT

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Purpose In a printed circuit board assembly (PCBA), the coefficient of thermal expansion (CTE) mismatch between the solder joint materials has a detrimental impact on reliability. The mechanical stresses caused by the thermal changes of the assembly lead to fatigue and sometimes the failure of the solder joints. The purpose of this study is to propose a novel pad design to obtain an interrupted solder/substrate interface, to improve the PCBA reliability. Design/methodology/approach An interruption in the continuous intermetallic compound (IMC) layer of a solder joint was implemented, by the deposition of a silicone film in the pad, changing its geometry. That change allows a redistribution of stresses in the most ductile zone of the solder joint, the solder. The stress concentration at the solder/substrate interface is reduced, as well as the general state of stress at the solder joint. Findings A new way was developed to reduce the stress on the solder joints, caused by thermal variations, because of the different components CTEs mismatch. This new method consists of interrupting the IMC layers of the solder joint, strategically, redirecting the usual stresses to a more ductile area of the joint, the solder. This is an innovative method that allows increase the lifetime of PCBAs and the equipments. Originality/value In this study, a new pad design concept for higher solder joint reliability was developed to reduce the shear stress in the solder joints because of the CTE mismatch between all the solder joint components.

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Impact of inter-metallic compound thickness on thermo-mechanical reliability of solder joints in solar cell assembly

Cited by 12 publications

References 8 publications

Introducing a new system performance function to formulate reliability analysis problems of wind turbines

Introducing a new system performance function to formulate reliability analysis problems of wind turbines

Expectation–maximization machine learning model for micromechanical evaluation of thermally-cycled solder joints in a semiconductor

Effect of the IMC layer geometry on a solder joint thermomechanical behavior

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