“…In the lead-free process of electronic packaging, the solder is typically a eutectic tin-based alloy containing Ag, Cu and small amounts of other elements (Pan et al , 2008; Wang et al , 2021; Osório and Garcia, 2016; Gain et al , 2016; Yang et al , 2020). The poor performance of lead-free soldering processes, particularly in terms of wetting performance, as well as concerns about post-solder dependability, are critical issues that need to be addressed for large-scale industrial applications (Chen et al , 2018; Capela et al , 2023; Ismail et al , 2022). Wettability is one of the most important physical properties to describe the interaction of liquid–solid interfaces, which has attracted widespread attention in recent years.…”