Impact of in situ current stressing on Sn-based solder joint shear stability

Fuller, Scott; Sheikh, Mohamed; Baty, Greg; Kim, Choong-Un; Lee, Tae‐Kyu

doi:10.1007/s10854-020-05038-3

Cited by 3 publications

(1 citation statement)

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“…In fact, the current density following through solder joints in industry may be much lower [27], which can also influence the shear performance of solder joint. When a low current density of 7.0 × 10 2 A/cm 2 is applied to the single-interface SAC105/Cu solder joints, the shear strength of solder joint under current stressing is about 9.5% higher than that at a corresponding T Joule [28]. This indicates that the athermal effect of current stressing may enhance shear performance.…”

Section: Introductionmentioning

confidence: 97%

Abnormal Shear Performance of Microscale Ball Grid Array Structure Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints with Increasing Current Density

Wang

Pan

2022

Crystals

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The shear performance and fracture behavior of microscale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints with increasing electric current density (from 1.0 × 103 to 6.0 × 103 A/cm2) at various test temperatures (25 °C, 55 °C, 85 °C, 115 °C, 145 °C, and 175 °C) were investigated systematically. Shear strength increases initially, then decreases with increasing current density at a test temperature of no more than 85 °C; the enhancement effect of current stressing on shear strength decreases and finally diminishes with increasing test temperatures. These changes are mainly due to the counteraction of the athermal effect of current stressing and Joule heating. After decoupling and quantifying the contribution of the athermal effect to the shear strength of solder joints, the results show that the influence of the athermal effect presents a transition from an enhancement state to a deterioration state with increasing current density, and the critical current density for the transition decreases with increasing test temperatures. Joule heating is always in a deterioration state on the shear strength of solder joints, which gradually becomes the dominant factor with increasing test temperatures and current density. In addition, the fracture location changes from the solder matrix to the interface between the solder matrix and the intermetallic compound (IMC) layer (the solder/IMC layer interface) with increasing current density, showing a ductile-to-brittle transition. The interfacial fracture is triggered by current crowding at the groove of the IMC layer and driven by mismatch strain at the solder/IMC layer interface, and the critical current density for the occurrence of interfacial fracture decreases with increasing test temperatures.

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Section: Introductionmentioning

confidence: 97%