2012
DOI: 10.5539/jmsr.v1n4p11
|View full text |Cite
|
Sign up to set email alerts
|

Impact of Forging Conditions on Plasma Nitrided Hot-forging Dies and Punches

Abstract:

In this work an effort has been made to study the effect on the performance of the plasma nitrided AISI H13 hot-forging dies and punches in two different forging service conditions –namely, fully-automatic and semi-automatic processes. The plasma nitriding is performed to increase the surface properties like –wear resistance and surface hardness of these components. After plasma nitriding the surface hardness of these materials has increased typically from ~500 HV0.01 to ~1200 HV0.01. … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3

Citation Types

0
3
0

Year Published

2012
2012
2022
2022

Publication Types

Select...
4
1

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(3 citation statements)
references
References 12 publications
0
3
0
Order By: Relevance
“…Changes in dimensions of hot forging dies due to wear or plastic deformation, deterioration of the surface finish, breakdown of lubrication, and cracking of surface layer, were all previously investigated by many researchers [5][6][7][8][9][10]. It was established that the thermal softening effect is the most common cause for die surface hardness decrease, which accelerates the die failure [11].…”
Section: Introductionmentioning
confidence: 99%
“…Changes in dimensions of hot forging dies due to wear or plastic deformation, deterioration of the surface finish, breakdown of lubrication, and cracking of surface layer, were all previously investigated by many researchers [5][6][7][8][9][10]. It was established that the thermal softening effect is the most common cause for die surface hardness decrease, which accelerates the die failure [11].…”
Section: Introductionmentioning
confidence: 99%
“…Dimensional stability at elevated temperatures is also equally required. The properties of these components should be improved [7][8][9].…”
Section: Introductionmentioning
confidence: 99%
“…Due to high absorptance (>90%) (Crouch et al, 2004) and wide absorption spectrum ranging from ultraviolet (UV) to near infrared (NIR) (Younkin et al, 2003;Das et al, 2012;Sheehy et al, 2005), nanostructured black silicon is an ideal material to fabricate sensitive photodetectors, solar cell (Yuan et al, 2009;Koynov et al, 2006), biochemical sensor (Noval et al, 2011), display devices (Treado et al, 1994;Tezcan et al, 2003;Fixe et al, 2004), gas sensor (Trakhtenberg et al, 2012). Nanostructure of the black silicon has been the focus of intense interest in recent years due to their extensive device application (Li et al, 2011;Li et al, 2008;Kumar et al, 2012). There are mainly four ways to fabricate black silicon-femtosecond laser (Wu et al, 2001;Kabashin et al, 2010;Othonos et al, 2009), deep reactive ion etch (DRIE) (Fischer et al, 2009), metal assisted wet etching (Branz et al, 2009), and electrochemical etching (Ma et al, 2006).…”
Section: Introductionmentioning
confidence: 99%