“…The noble metals with large work function such as Pt, Au, Ag, and Pd have been used for a Schottky contact on ZnO, 2,3 and the barrier height is not correlated with the obvious difference in the work functions. Recent reports claimed that the performance of Schottky contacts on ZnO bulk wafers were improved by various surface treatments, such as O 2 and/or O 2 /He plasma irradiation, 4 sulfide treatment, 5 UV ozone cleaning, 6 boiling H 2 O 2 treatment, 3,[7][8][9][10] and surface etching by using solutions of hydrochloric, 11 phosphoric, 12 and nitric acids, 13 before forming a Schottky contact with a metal. Surface treatment with the boiling H 2 O 2 was particularly effective in reducing the leakage current of the diode and the deep level emission photoluminescence signal: effects that were predicted by Chia-Hung Tsai et al 9 in terms of the passivation of donor behavior point defects at the surface of ZnO and a formation of an interface oxide layer.…”