“…An impermeable dye layer, screen-printed on the copper surface, was used as a mask and FeCl 3 dissolved the exposed Cu, leaving the desired electrode geometries under the dye (later easily removed with acetone). Chemical Au plating on Cu was obtained with Au(CN) 2 À and Au(CN) 4 À . An Au wire was dissolved in boiling HCl/HNO 3 (3:1) and then dried at 70-80 jC; HCl 37% was added and the solution dried again; finally, HCl 0.1 M was added to have AuCl 3 (0.6 g/l) in solution which was mixed with KCN (10.0 g/l), Na 2 HPO 4 (6.0 g/l), NaOH (1.0 g/l), Na 2 SO 3 (3.0 g/l).…”