Immersion Cooling of Vertically Mounted Plastic Packages Using Various Flourinert Liquids

Abstract

Liquid immersion cooling offers an alternative means to counter the high amount of heat dissipated by electronic packages. This study focuses on conjugate heat transfer analysis of a double PLCC packages mounted on a vertical PCB cooled by different Flourinert liquids such as FC 77, FC 3283, FC 43 and FC 70 with the aid of a CFD software. The effects of package power, flow velocity and the use of different types of dielectric liquids on the performance of the above PLCC packages are investigated. A comparison with air-cooled cases clearly indicates that a very much lower surface temperature exists on the operating packages in the case of dielectric liquids. For the convenience of application in the electronic industry, the results are presented in the form of correlations for junction temperature for each package.