IIIB-8 implications of high performance heat sinking for electron devices

Tuckerman, David B.; Pease, R. F. W.

doi:10.1109/t-ed.1981.20549

Cited by 24 publications

(13 citation statements)

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“…2. The effects of radiation, gravity, body forces, viscous dissipation [1] and surface roughness are neglected [46]. 3.…”

Section: Mathematical Models Boundary Conditions and Governing Equatmentioning

confidence: 99%

“…In the past few years, due to the fast development of micro/nanosystems in different engineering applications, like micro-electronics cooling applications, medical instruments, etc., the need to develop high performance compact thermal devices with high efficiency, minimum cost, lightweight and with the smallest size possible is necessary. Pioneered by Tuckerman and Pease [1], the concept of a rectangular microchannel heat sink made of silicon was first introduced. Since then active research on its thermal-hydraulic performance has been focused on by several investigators as reviewed by Adham et al [2], Agostani et al [3] and Morini.…”

Section: Introductionmentioning

confidence: 99%

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Thermal–Hydraulic Performance in a Microchannel Heat Sink Equipped with Longitudinal Vortex Generators (LVGs) and Nanofluid

et al. 2020

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In this study, the numerical conjugate heat transfer and hydraulic performance of nanofluids flow in a rectangular microchannel heat sink (RMCHS) with longitudinal vortex generators (LVGs) was investigated at different Reynolds numbers (200–1200). Three-dimensional simulations are performed on a microchannel heated by a constant temperature with five different configurations with different angles of attack for the LVGs under laminar flow conditions. The study uses five different nanofluid combinations of Al2O3 or CuO, containing low volume fractions in the range of 0.5% to 3.0% with various nanoparticle sizes that are dispersed in pure water, PAO (Polyalphaolefin) or ethylene glycol. The results show that for Reynolds number ranging from 100 to 1100, Al2O3–water has the best performance compared with CuO nanofluid with Nusselt number values between 7.67 and 14.7, with an associated increase in Fanning friction factor by values of 0.0219–0.095. For the case of different base fluids, the results show that CuO–PAO has the best performance with Nusselt number values between 9.57 and 15.88, with an associated increase in Fanning friction factor by 0.022–0.096. The overall performance of all configurations of microchannels equipped with LVGs and nanofluid showed higher values than the ones without LVG and water as a working fluid.

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“…2. The effects of radiation, gravity, body forces, viscous dissipation [1] and surface roughness are neglected [46]. 3.…”

Section: Mathematical Models Boundary Conditions and Governing Equatmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Thermal–Hydraulic Performance in a Microchannel Heat Sink Equipped with Longitudinal Vortex Generators (LVGs) and Nanofluid

et al. 2020

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“…The above relation clearly shows that the source-to-drain current is maximum when the gate voltage (or, equivalently, the gate induced electric field y Ε ) is such that Φ is an even multiple of π, and it falls to zero when the gate voltage is such that Φ is an odd multiple of π. Since Φ depends on E y (see Equation (5) is also the ratio of the ON-current to OFF-current at a fixed source-to-drain bias, will be infinity since the OFF-current (corresponding to ( ) 2 1 n π Φ = + ) is zero 3 . In reality, this can be true only if the source spin injection efficiency and the drain spin detection efficiency are both 100%, i.e.…”

Section: The Spin Field Effect Transistor (Spinfet)mentioning

confidence: 99%

Electron spin for classical information processing: a brief survey of spin-based logic devices, gates and circuits

2009

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In electronics, information has been traditionally stored, processed and communicated using an electron's charge. This paradigm is increasingly turning out to be energy-inefficient, because movement of charge within an information processing device invariably causes current flow and an associated dissipation. Replacing 'charge' with the 'spin' of an electron to encode information may eliminate much of this dissipation and lead to more energy-efficient 'green electronics'. This realization has spurred significant research in spintronic devices and circuits where spin either directly acts as the physical variable for hosting information or augments the role of charge. In this review article, we discuss and elucidate some of these ideas, and highlight their strengths and weaknesses. Many of them can potentially reduce energy dissipation significantly, but unfortunately are error-prone and unreliable. Moreover, there are serious obstacles to their technological implementation that may be difficult to overcome in the near term. This review addresses three constructs: (1) single devices or binary switches that can be constituents of Boolean logic gates for digital information processing, (2) complete gates that are capable of performing specific Boolean logic operations, and (3) combinational circuits or architectures (equivalent to many gates working in unison) that are capable of performing universal computation.

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“…In 1981, Tuckerman et al rstly experimentally studied the convective heat transfer in microchannels and they veried that employing the cooling uid ow in microchannels could effectively dissipate the heat. 11 By driving the water to ow in the silicon microchannels with different aspect ratios, Wu et al discovered the uid temperature jump and velocity slip at the microchannel walls in their experiments. 12 Besides, they concluded that the surface roughness and surface hydrophilic property determined the Nusselt number.…”

Section: Introductionmentioning

confidence: 99%

Molecular dynamics study of convective heat transfer mechanism in a nano heat exchanger

Sun

Wang

et al. 2020

RSC Adv.

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IIIB-8 implications of high performance heat sinking for electron devices

Cited by 24 publications

References 0 publications

Thermal–Hydraulic Performance in a Microchannel Heat Sink Equipped with Longitudinal Vortex Generators (LVGs) and Nanofluid

Thermal–Hydraulic Performance in a Microchannel Heat Sink Equipped with Longitudinal Vortex Generators (LVGs) and Nanofluid

Electron spin for classical information processing: a brief survey of spin-based logic devices, gates and circuits

Molecular dynamics study of convective heat transfer mechanism in a nano heat exchanger

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