The performance characteristics of polycrystalline SiGe microbolometer arrays are the subject of both design and technological optimizations performed in this work to move the arrays towards the production. An NETD of 90 mK at a time constant of 11 ms is already achievable for the best non-optimized 60 µm pixel, 0.26 µm thick bolometer design in a linear 128 pixel array according to the results of LWIR characterization. The performance of linear 32, 64 and 128 element arrays of 50-, 60-and 75-µm pixel bolometers made with 0.26…0.13 µm thin poly-SiGe on several wafer runs was the starting point for the computer simulation of detector features and evolution of its characteristics under reading bias pulses. The material properties and parameters of read-outs are taken into account in the optimization of the design parameters of arrays as well. The typical bolometer characteristics achieved on the latest wafer run if processed with the PC-program accounting for the read-out and heating effects, result in an average NETD of 70 mK at a time constant of 17 ms for 50 µm pixels in a 320×240 array. Despite less TCR-to-1/f noise ratio as compared with VO x arrays, the several advantages make poly-SiGe a very attractive candidate for an uncooled array, i.e. full compatibility with CMOS technology, better characteristics/price ratio, resistance nonuniformity σ/mean <0.2%, and a possibility to release extrathin structures.