In situobservation of the grain growth of the copper electrodeposits for ultralarge scale integration

Abstract

The grain growth which occurs during the self-annealing in copper electrodeposits was investigated by in situ observation with an electron backscattered diffraction technique. From these observations, it was found that a newly created twin was initiated on the front interface of growing twin and that the transverse direction for the growth was ͗110͘. Most of the twins had the ⌺3 twin boundary of ͕111͖͗110͘. The formation of the twin and its peculiar growth direction could be explained quite well based on the hypothesis that the growth front interface is one of the ͕111͖ planes.

Yield Point Phenomenon Induced by Twinning Accompanied by Abnormal Grain Growth in Fine-Grained Copper

“…As another characteristic, such abnormal grain growth is known to be related to the selfannealing behavior of fine-grained pure copper. 1826,48) Apparently, the self-annealing kinetic seems to be accelerated by the applied stress during the tensile test; therefore, the abnormal grain growth occurs very rapidly at the moment of Lüders band formation. 2330) Also, recrystallization and grain coarsening due to the mechanically induced selfannealing in Reg.…”

“…13) Therefore, methods for fabricating fine-grained materials with high strength and toughness have been extensively studied over the past few years. 48) Severe plastic deformation (SPD) is a well-known process for generating fine-grained structures by subjecting a metallic material to a very large plastic deformation. 913) Among the various SPD processes, equal-channel angular pressing (ECAP) and high-pressure torsion (HPT) are most commonly used.…”

Extracting Cu(II) from aqueous solutions with hydrophobic room-temperature ionic liquid in the presence of a pyridine-based ionophore to attempt Cu recovery: A laboratory study

“…The importance of copper is continuously growing because of electronic devices, such as mobile phones and computers in which copper is the main element in modern electronic circuits. Copper circuits are usually fabricated by electrodeposition and/or etching [1][2][3][4]. Aqueous solutions containing copper ions are thus employed [5][6][7] or produced.…”

Microstructure and Pattern Size Dependence of Copper Corrosion in Submicron-Scale Features

“…1,2 In addition, the copper electrodeposits have nanocrystalline structure, and then the copper microstructure in each pattern was evolved strongly depending on its pattern dimension during annealing process. [3][4][5] The recrystallization of the as-deposited copper electrodeposits was already investigated by in situ observation of electron-backscattered-diffraction (EBSD) analysis, and it was found out that the grain growth happened anisotropically having a preferred orientation of its growing direction. 3 Consequently, the annealed microstructure has very anisotropic structure, and various phenomena happened being related with such anisotropic microstructure.…”

“…[3][4][5] The recrystallization of the as-deposited copper electrodeposits was already investigated by in situ observation of electron-backscattered-diffraction (EBSD) analysis, and it was found out that the grain growth happened anisotropically having a preferred orientation of its growing direction. 3 Consequently, the annealed microstructure has very anisotropic structure, and various phenomena happened being related with such anisotropic microstructure. The reliability issue of stress-induced voiding is one of the examples.…”