Correlations among interface properties and chemical bonding characteristics in
HfnormalO2∕GenormalOxnormalNy∕Ge
metal–insulator–semiconductor stacks were investigated using in situ remote nitridation of the Ge(100) surface prior to
HfnormalO2
atomic layer deposition. Ultrathin
(∼1.1nm)
, thermally stable, and aqueous etch-resistant
GenormalOxnormalNy
interface layers that exhibited Ge core-level photoelectron spectra similar to stoichiometric
normalGe3normalN4
were synthesized. To evaluate
GenormalOxnormalNy∕Ge
interface defects, the density of interface states
(Dit)
was extracted by the conductance method across the bandgap. Forming gas annealed (FGA) samples exhibited substantially lower
Dit
(∼1×1012cm−2eV−1)
than did high-vacuum-annealed and inert gas anneal samples
(∼1×1013cm−2eV−1)
. Germanium core-level photoelectron spectra from similar FGA-treated samples detected out-diffusion of germanium oxide to the
HfnormalO2
film surface and apparent modification of chemical bonding at the
GenormalOxnormalNy∕Ge
interface which is related to the reduced
Dit
.