I-11 Optimization of mixed colloidal silica and fullerenol slurry in Chemical Mechanical Polishing of Sapphire

Bun-Athuek, Natthaphon; Khajornrungruan, Panart; Murakawa, Wataru; Satou, Tokihito; Suzuki, Keisuke

doi:10.1299/jsmekyushu.2016.69.361

Cited by 1 publication

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“…They reported that the material removed from polished substrates adhered to fine particles after the CMP, which is increase in fine particle size in the slurry. [16][17][18][19][20][21] However, the characteristics of abrasive particles during CMP are still unclarified and must be studied further. In this research, we studied the change in fine particle size in slurries including its effect on the performance of the CMP technique.…”

Section: Introductionmentioning

confidence: 99%

Study on effect of the surface variation of colloidal silica abrasive during chemical mechanical polishing of sapphire

Bun-Athuek

Yoshimoto

Sakai

et al. 2017

Jpn. J. Appl. Phys.

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The surface and diameter size variations of colloidal silica particles during the chemical mechanical polishing (CMP) of sapphire substrates were investigated using different particle diameters of 20 and 55 nm. Dynamic light scattering (DLS) results show that the silica particles became larger after CMP under both conditions. The increase in particle size in the slurry was proportional to the material removal amount (MRA) as a function of the removed volume of sapphire substrates by CMP and affected the material removal rate (MRR). Transmission electron microscopy (TEM) images revealed an increase in the size of the fine particles and a change in their surface shape in the slurry. The colloidal silica was coated with the material removed from the substrate during CMP. In this case, the increase in the size of 55 nm diameter particles is larger than that of 20 nm diameter particles. X-ray fluorescence spectrometry (XRF) results indicate that the aluminum element from polished sapphire substrates adhered to the surfaces of silica particles. Therefore, MRR decreases with increasing of polishing time owing to the degradation of particles in the slurry.

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Section: Introductionmentioning

confidence: 99%