Study on effect of the surface variation of colloidal silica abrasive during chemical mechanical polishing of sapphire

Bun-Athuek, Natthaphon; Yoshimoto, Yutaka; Sakai, Koya; Khajornrungruang, Panart; Suzuki, Keisuke

doi:10.7567/jjap.56.07kb01

Cited by 13 publications

(8 citation statements)

References 22 publications

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“…Some experimental reports have provided evidence that material was transferred from the upper silicon plate to the silica cluster. For example, Bun-Athuek et al [37] experimentally investigated changes in the surfaces and diameters of colloidal silica abrasives during the CMP of sapphire substrates. It was discovered that alumina elements from sapphire substrates dispersed in the used slurry and also aggregated on the surface of the abrasive after polishing when the diameter of the abrasive was 55 nm.…”

Section: Materials Removal Processmentioning

confidence: 99%

Novel three-body nano-abrasive wear mechanism

Chen

2021

Friction

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Current three-body abrasive wear theories are based on a macroscale abrasive indentation process, and these theories claim that material wear cannot be achieved without damaging the hard mating surface. In this study, the process of three-body nano-abrasive wear of a system including a single crystalline silicon substrate, an amorphous silica cluster, and a polyurethane pad, based on a chemical mechanical polishing (CMP) process, is investigated via molecular dynamics simulations. The cluster slid in a suspended state in smooth regions and underwent rolling impact in the asperity regions of the silicon surface, realizing non-damaging monoatomic material removal. This proves that indentation-plowing is not necessary when performing CMP material removal. Therefore, a non-indentation rolling-sliding adhesion theory for three-body nano-abrasive wear between ultrasoft/hard mating surfaces is proposed. This wear theory not only unifies current mainstream CMP material removal theories, but also clarifies that monoatomic material wear without damage can be realized when the indentation depth is less than zero, thereby perfecting the relationship between material wear and surface damage. These results provide new understanding regarding the CMP microscopic material removal mechanism as well as new research avenues for three-body abrasive wear theory at the monoatomic scale.

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Section: Materials Removal Processmentioning

confidence: 99%

Novel three-body nano-abrasive wear mechanism

Chen

2021

Friction

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“…These results indicated that the downward force per particle (mechanical factor) is the dominant factor for polishing sapphire using silica particles with sizes of 20, 55, and 105 nm because the indentation ability of silica particles of 20 nm was lower than that obtained using the larger particles. 30,31) In the case where the ultrafine colloidal silica particles alone produced a very high MRR for sapphire, this indicated that chemical reactivity may be the main factor because small fine particles need a smaller activation energy to react with the sapphire substrate surface, as reported by Zhou et al 32) In addition, at the same slurry contents for the hybrid (2.5 mass % each of the ultrafine colloidal and large silica slurries, giving a total of 5 mass %) and single-sized (5 mass %) silica slurries, we found that the former abrasives gave larger MRRs for sapphire. The MRRs of sapphire obtained by mixing ultrafine silica particles into silica slurries with particle sizes of 20, 55, and 105 nm increased by about 85, 78, and 32%, respectively.…”

Section: Materials Removal Rate Of Sapphirementioning

confidence: 99%

Effects of mixed ultrafine colloidal silica particles on chemical mechanical polishing of sapphire

Bun-Athuek

Takazaki

Yoshimoto

et al. 2018

Jpn. J. Appl. Phys.

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The effects of ultrafine colloidal silica particles adsorbed on the surfaces of large silica particles in slurries used for the chemical mechanical polishing of sapphire were studied. Sapphire wafers were polished using hybrid silica particles that were composed of a mixture of ultrafine (4 nm) colloidal silica particles and large (20, 55, and 105 nm) silica particles. Dynamic light scattering results showed that the hybrid particles became larger after mixing. Transmission electron microscopy images revealed that the ultrafine particles adhered to the surfaces of the large particles and that the surface shape of the hybrid particles were changed by the mixing process. Atomic force microscopy and polishing results showed that the surface roughnesses and material removal rates of sapphire substrates were improved by using the hybrid particles. The coefficient of friction between the surface of the sapphire substrate and the hybrid particles was higher than that obtained using single-sized particles. These results confirm that the hybrid silica particles enhanced the performance of sapphire polishing.

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“…Chemical mechanical polishing (CMP) technology, due to its ultrahigh accuracy and global planarization performance, is widely used in the LED substrates, high-end integrated circuits and medical device fields (Aida et al , 2021; Bun-Athuek et al , 2017;Krishnan et al , 2010). Polishing pad is one of the critical parts in CMP system, which has a direct influence on the workpiece surface quality (Kenchappa et al , 2021).…”

Section: Introductionmentioning

confidence: 99%

Tribological glazing evolution of fixed abrasive pad under different polishing solution conditions

Tian,

Wu,

Pang

et al. 2023

ILT

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Purpose This study aims to clarify the influence mechanism of polishing solution type on the glazing evolution of fixed abrasive pad under different interfacial pressure conditions. Design/methodology/approach The tribological experiments were carried out on the friction and wear machinery with W3-5 diamond fixed abrasive pad and quartz glass workpiece under three polishing solution types of five pressure conditions. The changes of surface morphology, porosity and hardness of fixed abrasive pad were detected by white light interferometer, optical microscope and shore hardness tester. Findings The results showed that the glazed phenomenon of fixed abrasive pad is occurred after a certain time, which is more obvious with the increasing of interfacial pressures. The polishing solution type has a significant effect on the glazing time, although the glazed phenomenon is inevitable. The mechanism of it is that the micro-convex peaks on the surface of the fixed abrasive pad are easily wear, and the pores are blocked by the accumulation of waste debris generated during the experiment process. Thus, a smooth and high-density hard layer is formed on the surface of the fixed abrasive pad which induces the decreasing of the friction coefficient and surface roughness value. For selected polishing solution types, the wear rate of micro-convex peaks is different due to the corrosion action difference with polishing pad surface. Originality/value The main contribution of this work is to provide a new investigating method for further understanding the glazing evolution mechanism of fixed abrasive pad. Peer review The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-08-2023-0257/

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Study on effect of the surface variation of colloidal silica abrasive during chemical mechanical polishing of sapphire

Cited by 13 publications

References 22 publications

Novel three-body nano-abrasive wear mechanism

Novel three-body nano-abrasive wear mechanism

Effects of mixed ultrafine colloidal silica particles on chemical mechanical polishing of sapphire

Tribological glazing evolution of fixed abrasive pad under different polishing solution conditions

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