“…The replacement of SiO 2 with high-k dielectrics (dielectric constant larger than that of SiO 2 , 3.9)is a solution to the challenge. In MOSFET technology, SiO 2 was replaced by a hafnium-based high-k material in 2007 [2].When the high-k material is used, a smaller equivalent oxide thickness (EOT) is obtained compared to SiO 2 gate dielectric with same physical thickness [3].In other words, the gate dielectrics with small EOT can be obtained without the expense of an increase of the leakage current by the employment of high-k material. Therefore, a number of high-k materials, HfO 2 , ZrO 2 , Y 2 O 3 and their silicates, have been widely researched [4,5].…”