2011
DOI: 10.1063/1.3662953
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Hydrogenation and surface density changes in hydrocarbon films during erosion using Ar/H2 plasmas

Abstract: We report interactions of low pressure Ar, H 2 , and Ar/H 2 mixture plasmas with a-C:H films. Surface evolution and erosion of a-C:H films were examined for ion energies up to 200 eV by rf biasing the substrates. Film surfaces were characterized using in situ ellipsometry, x-ray photoelectron spectroscopy, and atomic force microscopy. Multilayer models for steady-state modified surface layers are constructed using ellipsometric data and compared with results of molecular dynamics (MD) simulations and transport… Show more

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Cited by 20 publications
(14 citation statements)
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References 39 publications
(66 reference statements)
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“…4 Recent works have aimed at characterizing plasma properties and surface interacting species in Ar/H 2 plasmas. [4][5][6][7][8][9][10][11][12] At low pressure (1-100 mTorr), major surface interacting species in Ar/H 2 plasmas are ions, reactive H atoms, UV/VUV photons, and Ar metastable atoms. Gudmundsson first measured the ion mass and energy distributions for most ion types present (H þ , H 2 þ , H 3 þ , and Ar þ ).…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…4 Recent works have aimed at characterizing plasma properties and surface interacting species in Ar/H 2 plasmas. [4][5][6][7][8][9][10][11][12] At low pressure (1-100 mTorr), major surface interacting species in Ar/H 2 plasmas are ions, reactive H atoms, UV/VUV photons, and Ar metastable atoms. Gudmundsson first measured the ion mass and energy distributions for most ion types present (H þ , H 2 þ , H 3 þ , and Ar þ ).…”
Section: Introductionmentioning
confidence: 99%
“…4 The etch rate becomes significantly higher and large degrees of surface re-hydrogenation of the H-depleted surface is observed. When etching hydrocarbons at low pressures, we found that the plasma-surface interactions transitions from a purely physical sputtering regime to a chemical sputtering regime when up to 20% H 2 is added to Ar plasma.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, H 2 -Ar mixtures were successfully applied for hydrogenation of thin film transistors 12 and to control the surface properties of polymers 13 . Hopf et al observed chemical sputtering of hydrocarbon films with very high rates if energetic Ar and atomic hydrogen interact simultaneously 14 with carbonaceous surfaces.…”
Section: Introductionmentioning
confidence: 99%
“…H 2 -Ar mixtures were successfully applied for hydrogenation of thin film transistors 12 and to control the surface properties of polymers 13 . Hopf et al observed chemical sputtering of hydrocarbon films with very high rates when energetic Ar and atomic hydrogen were interacting simultaneously 14 .…”
Section: Introductionmentioning
confidence: 99%