2001
DOI: 10.1016/s0025-5408(01)00697-3
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Hydrogen-induced degradation of PMN-based relaxor ferroelectrics during nickel electroplating

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Cited by 13 publications
(5 citation statements)
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“…The Pb metal may appear as a result of the reduction of Pb 2+ ions to Pb 0 during etching in the acetic acid. Similar sets of two Pb 4f doublets were observed for PMN and PZT thin films [30,31,[37][38][39][40]. These four samples are fragile and micro-cracks during the cooling from crystallization process might be formed.…”
Section: Photoemission Resultssupporting
confidence: 64%
See 1 more Smart Citation
“…The Pb metal may appear as a result of the reduction of Pb 2+ ions to Pb 0 during etching in the acetic acid. Similar sets of two Pb 4f doublets were observed for PMN and PZT thin films [30,31,[37][38][39][40]. These four samples are fragile and micro-cracks during the cooling from crystallization process might be formed.…”
Section: Photoemission Resultssupporting
confidence: 64%
“…As stated in [26]: 'core-level x-ray photoelectron spectroscopy probes the local potentials at lattice sites in a solid and so should be able to provide information on both the conditionally averaged site potentials in a disordered alloy and fluctuations about those averages'. Up to now the systematic XPS studies of PMN-PT solid solutions have not been reported and only a few papers concerned mainly with pure PMN are available [29][30][31].…”
Section: Introductionmentioning
confidence: 99%
“…The spectra were well in accordance with a single Gaussian component. 45 These results represent the positive bivalent states of the Pb element. Fig.…”
Section: Resultsmentioning
confidence: 87%
“…2,3) The second is plating, and one of the key factors in plating is the overgrowth of plating layers. [4][5][6][7][8][9][10][11] As the literature indicates, such overgrowth is an effect of the low resistance of ceramics caused by the hydrogen ions that are produced during plating, decreasing the surface resistivity of components. Although the issue of component reliability is very important, few papers deal with this issue systematically; thus, in this work, we performed a life test and studied the performance and failure modes of chip inductors to determine the root causes and mechanisms of chip inductor failure.…”
Section: Introductionmentioning
confidence: 99%