Hybrid working stamps for high speed roll-to-roll nanoreplication with molded sol–gel relief on a metal backbone

Schleunitz, Arne; Spreu, Christian; Mäkelä, Tapio; Haatainen, Tomi; Klukowska, Anna; Schift, Helmut

doi:10.1016/j.mee.2011.02.019

Cited by 30 publications

(14 citation statements)

References 14 publications

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“…Without intermediate layer, the thickness of the backplane is essential for the flexibility of the stamp obtained. For example, a hybrid stamp from OrmoStamp (micro resist technology) with a Ni-foil of 30 lm thickness as backplane provides a flexibility that is high enough for mounting in a roll-to-roll system [15]. However, roll-to-roll processes do not inherently rely on low pressures.…”

Section: Introductionmentioning

confidence: 99%

Single-layer versus two-layer stamps for reduced pressure thermal nanoimprint

et al. 2015

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Low-pressure imprint is interesting to avoid stamp deformation, stamp failure as well as polymer recovery. When large-area stamps are prepared with a stepping procedure, low pressure is required to optimize the stitching. However, with low-pressure imprint, conformal contact between stamp and substrate is critical. Admittedly, the imprint pressure required for conformal contact depends on the stamp material and its thickness. To get an idea to which extent the imprint pressure can be reduced with a flexible stamp, we compared different stamp materials and stamp architectures, single-layer stamps and two-layer stamps. The two-layer stamps are replica stamps, where the structures were replicated in a thin layer of OrmoStamp, fixed by a backplane. On the background of plate theory, we deduce the pressure reduction compared to a Si stamp by calculating the respective pressure ratio, independent from geometries. In addition, temperature-induced issues are addressed which are of relevance for a thermal imprint process. These issues are related to the mismatch between the thermal expansion coefficients of the stamp and the substrate, and in case of a two-layer stamp, to the mismatch between the backplane material and the top layer. The latter results in temperatureinduced stamp bending. On the basis of simple analytical calculations, the potential of single-layer stamps and twolayer stamps with respect to thermal imprint at reduced pressure is discussed and guidelines are provided to assess the imprint situation when replica stamps are used for imprint. The results demonstrate the attractiveness of twolayer stamps for reduced pressure nanoimprint, even in a temperature-based process.

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Section: Introductionmentioning

confidence: 99%

Single-layer versus two-layer stamps for reduced pressure thermal nanoimprint

et al. 2015

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“…However, the cycle time of conventional thermal nanoimprinting using a flat mold is long because the substrate and mold are heated and cooled from the outside in the process. To replicate patterns at a high speed, roller nanoimprinting has been proposed, in which patterns are continuously replicated by using a roller mold and a counter roller [9][10][11][12][13][14]. Fig.…”

Section: Introductionmentioning

confidence: 99%

High-speed replication of light-extraction structure with thermal roller nanoimprinting

Takahashi

Nagato

Hamaguchi

et al. 2015

Microelectronic Engineering

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“…[16][17][18][19] Also, stamps with surface structures in hybrid organic-inorganic polymers (e.g., Ormostamp® from micro resist technology GmbH, Berlin), or hydrogen silsesquioxane (HSQ) were used and sub-100-nm patterning demonstrated. [20][21][22][23][24] Using this, down to 18-nm resolution was achieved using standard injection molding.…”

Section: Introductionmentioning

confidence: 99%

Nanoimprint lithography process chains for the fabrication of micro- and nanodevices

Schift

Urwyler

Kristiansen³

et al. 2014

J. Micro/Nanolith. MEMS MOEMS

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Abstract. The nanoimprint lithography (NIL) process with its key elements molding and thin film pattern transfer refers to the established process chain of resist-based patterning of hard substrates. Typical processes for mass fabrication are either wafer-scale imprint or continuous roll-to-roll processes. In contrast to this, similar process chains were established for polymeric microelements fabricated by injection molding, particularly when surface topographies need to be integrated into monolithic polymer elements. NIL needs to be embedded into the framework of general replication technologies, with sizes ranging from nanoscopic details to macroscopic entities. This contribution presents elements of a generalized replication process chain involving NIL and demonstrates its wide application by presenting nontypical NIL products, such as an injection-molded microcantilever. Additionally, a hybrid approach combining NIL and injection molding in a single tool is presented. Its aim is to introduce a toolbox approach for nanoreplication into NIL-based processing and to facilitate the choice of suitable processes for micro-and nanodevices. By proposing a standardized process flow as described in the NaPANIL library of processes, the use of establish process sequences for new applications is facilitated.

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Hybrid working stamps for high speed roll-to-roll nanoreplication with molded sol–gel relief on a metal backbone

Cited by 30 publications

References 14 publications

Single-layer versus two-layer stamps for reduced pressure thermal nanoimprint

Single-layer versus two-layer stamps for reduced pressure thermal nanoimprint

High-speed replication of light-extraction structure with thermal roller nanoimprinting

Nanoimprint lithography process chains for the fabrication of micro- and nanodevices

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