Flexible stamps are common for roll-to-roll processing but less common with planar processing, although they offer a number of benefits as, e.g., an improved conformal contact at reduced pressure. A simple way to realize such a flexible stamp is to use a two layer system with a structured top layer and a flexible backplane. The structured top layer is most easily obtained by molding, the backplane provides the flexibility envisaged. For use in a thermal nanoimprint process, a high thermal stability is required for both. This investigation addresses the preparation of flexible composite stamps with OrmoStamp as the structured top layer and polyimide as the flexible backplane. The process recommended for stamp preparation with OrmoStamp has to be modified to avoid bending after the hard bake that is required after ultraviolet-curing of the material to obtain a high stability of the top layer. Reduction of bending is advised, in particular, for large area stamps, where the hard bake step is in conflict with preparation of a flat stamp and limits applicability for thermal nanoimprint. A small scale almost flat flexible composite stamp is prepared and employed for low-pressure nanoimprint; it provides full area imprint at a reduced pressure of 25 bar. The replicated structures, lines of 300 nm, are of high quality and image the stamp structures. Stamps prepared in this way allow a tuning of the flexibility simply by changing the thickness of the backplane.
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