Hybrid technology for the production of highly integrated multi-chip microcircuits: problems and solutions

Abstract

Innovative technologies in the field of microelectronics provide technological transformation of the crystal and multichip microcircuit industry, combining various methods of crystal mounting and packaging processes. An increase in the integration of electronic circuits, an increase in the number of peripheral elements and, as a result, an increase in the energy consumption of the crystal, lead to a significant increase in the complexity of solving the problems of packaging when the case is converted into a complex electronic device. Chip crystals, according to current technological standards, are produced by a small number of specialized companies owned by transnational corporations. At the same time, in a number of countries there are qualified personnel specializing in the design of integrated circuits. One of the trends in the Russian market of multifunctional miniature devices is import substitution. A patent information search was conducted to identify trends and directions in the development of technologies in the field of packaging integrated circuits. A detailed analysis of the problem of the production of multi-chip microcircuits, systems in a package combining various packaging processes is shown; ways to solve it are shown, including applied research aimed at creating a hybrid multi-chip packaging technology combining crystals installed in a single package and on a single substrate using various methods installation - Wire bond and Flip chip.