Hybrid integration of chipscale photonic devices using accurate transfer printing methods

Abstract

Transfer printing is becoming widely adopted as a back-end process for the hybrid integration of photonic and electronic devices. Integration of membrane components, with micrometer-scale footprints and sub-micron waveguide dimensions, imposes strict performance requirements on the process. In this review, we present an overview of transfer printing for integrated photonics applications, covering materials and fabrication process considerations, methods for efficient optical coupling, and high-accuracy inter-layer alignment. We present state-of-the-art integration demonstrations covering optical sources and detectors, quantum emitters, sensors, and opto-mechanical devices. Finally, we look toward future developments in the technology that will be required for dense multi-materials integration at wafer scales.

Recent Progress in Printed Photonic Devices: A Brief Review of Materials, Devices, and Applications

“…The performance of a printed photonic device greatly benefits from careful alignment and registration of its various components [ 144 ]. Optical losses, decreased device efficiency, and compromised functionality are all possible results of improper alignment [ 145 , 146 ].…”

Switchable Adhesive Based on Shape Memory Polymer with Micropillars of Different Heights for Laser-Driven Noncontact Transfer Printing

“…Transfer printing, as an advanced heterogeneous material integration technique, − has greatly attracted the interest of academia and industry due to its great potential in deterministic assembly with applications in developing unconventional electronic systems, such as curved electronics, − micro light-emitting diode display, − and flexible electronics. − The typical process of transfer printing is to utilize a switchable adhesive (i.e., stamp) to pick up electronic components (i.e., inks) of different shapes or materials from their fabricated substrate (i.e., donor) and print them onto the target substrate (i.e., receiver). The ability of adhesion switch in a rapid and repeatable manner enabled by the switchable adhesive from a strong state for pick-up to a weak state for printing is essential to the success of transfer printing.…”

Highly Accurate Docking of a Photonic Crystal Nanolaser to a SiNx Waveguide by Transfer Printing

“…This technology provides a simple and efficient way to integrate different types of devices onto the same platform one by one without disturbing each other. Depending on the type of transfer media and transfer facilities, this technique can be divided into two methods: pick-and-place − and transfer printing. ,,− The former typically performs hybrid integration using a nanotip under a scanning electron microscope (SEM). Although it can provide high accuracy in integrating devices into predetermined locations, it also has the disadvantages of low fabrication throughput and requiring expensive facilities.…”

“…Although it can provide high accuracy in integrating devices into predetermined locations, it also has the disadvantages of low fabrication throughput and requiring expensive facilities. Instead, transfer printing − typically involves the use of an elastic poly­(dimethylsiloxane) (PDMS) μ-stamp to carry out a similar operation under a less expensive facility such as an optical microscope (OM).…”

“…In recent years, the alignment accuracy of the transfer printing method has also been greatly improved by the cooperation of actuators and microscope systems with high resolutions. This improvement allows it to achieve sub-wavelength-level misalignment of wire-to-wire integration in PICs, as well as suitable for different dielectric or metallic nanophotonic structures ,,− onto different platforms. For example, highly efficient coupling can be achieved by integrating nanowires − or photonic crystal (PhC) nanobeam (NB) − light sources with silicon-based waveguides.…”