Hybrid Integrated Platforms for Silicon Photonics

Liang, Di; Roelkens, Günther; Baets, Roel; Bowers, John E.

doi:10.3390/ma3031782

Cited by 263 publications

(160 citation statements)

References 60 publications

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“…Feasibility of all-in-one photonics has been hindered by the complicated fabrication processes required, coupled with inefficient, high loss conversion of optical to electronic signals. Gallium arsenide, indium phosphide, and other III-V semiconductors are the chief substrate materials for photonics, while the predominant substrate in electronics is undoubtedly silicon [2]. Despite the predominant preference for these materials in their respective fields, the largely mismatched lattice constant and/or thermal expansion coefficient (TEC) makes integration challenging.…”

Section: Integration Of Photonic Components Into Microelectronicsmentioning

confidence: 99%

“…As an alternative to typical high-temperature methods used to create strong bonding, O 2 plasma surface treatment or SiO 2 covalent wafer bonding (see Figure 1) has been used [2]. These methods result in robust bonding under low temperature (< 400°C) [5,6].…”

Section: Integration Of Photonic Components Into Microelectronicsmentioning

confidence: 99%

“…Under the second theme of photonics and microelectronics integration, adhesive wafer bonding (see Figure 2) requires thermosetting adhesives due to the required post-bonding processing temperatures for optoelectronic components, which exceed 400°C [2]. Based on the material properties desired, different adhesives are used under various bond strength and annealing temperatures.…”

Section: Integration Of Photonic Components Into Microelectronicsmentioning

confidence: 99%

“…The final theme for assimilation of photonic and micro-electronics assembly requires hybridization of typical integration methods used [2,[12][13][14][15]. One example of hybrid assembly is the hybrid silicon platform developed by the University of California at Santa Barbara and Intel Corporation.…”

Section: Integration Of Photonic Components Into Microelectronicsmentioning

confidence: 99%

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Electrospinning for nano- to mesoscale photonic structures

et al. 2016

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Abstract:The fabrication of photonic and electronic structures and devices has directed the manufacturing industry for the last 50 years. Currently, the majority of small-scale photonic devices are created by traditional microfabrication techniques that create features by processes such as lithography and electron or ion beam direct writing. Microfabrication techniques are often expensive and slow. In contrast, the use of electrospinning (ES) in the fabrication of microand nano-scale devices for the manipulation of photons and electrons provides a relatively simple and economic viable alternative. ES involves the delivery of a polymer solution to a capillary held at a high voltage relative to the fiber deposition surface. Electrostatic force developed between the collection plate and the polymer promotes fiber deposition onto the collection plate. Issues with ES fabrication exist primarily due to an instability region that exists between the capillary and collection plate and is characterized by chaotic motion of the depositing polymer fiber. Material limitations to ES also exist; not all polymers of interest are amenable to the ES process due to process dependencies on molecular weight and chain entanglement or incompatibility with other polymers and overall process compatibility. Passive and active electronic and photonic fibers fabricated through the ES have great potential for use in light generation and collection in optical and electronic structures/ devices. ES produces fiber devices that can be combined with inorganic, metallic, biological, or organic materials for novel device design. Synergistic material selection and postprocessing techniques are also utilized for broad-ranging applications of organic nanofibers that span from biological to electronic, photovoltaic, or photonic. As the ability to electrospin optically and/or electronically active materials in a controlled manner continues to improve, the complexity and diversity of devices fabricated from this process can be expected to grow rapidly and provide an alternative to traditional resource-intensive fabrication techniques.

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Section: Integration Of Photonic Components Into Microelectronicsmentioning

confidence: 99%

Section: Integration Of Photonic Components Into Microelectronicsmentioning

confidence: 99%

Section: Integration Of Photonic Components Into Microelectronicsmentioning

confidence: 99%

Section: Integration Of Photonic Components Into Microelectronicsmentioning

confidence: 99%

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Electrospinning for nano- to mesoscale photonic structures

et al. 2016

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“…© 2017 Author (s In recent years, significant breakthrough has been made in the field of silicon photonics, and various Si-based integrated photonic devices have been developed, making Si-based optical systems promising for future information processing and communications, especially in data center and supercomputing. [1][2][3][4] However, silicon is not an efficient light emitting material due to its indirect band gap. As a result, bonding III-V compound semiconductors to silicon-on-insulator (SOI) wafers has become a key technology to realize hybrid integrated light sources in silicon photonics.…”

mentioning

confidence: 99%

Oxides formation on hydrophilic bonding interface in plasma-assisted InP/Al2O3/SOI direct wafer bonding

et al. 2017

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Successful direct wafer bonding between InP and silicon-on-insulator (SOI) wafers has been demonstrated by adopting a 20-nm-thick Al2O3 as the intermediate layer. A detailed investigation on the property of the bonding interface is carried out. Water contact angle test reveals an improved hydrophilicity for both the InP and the Al2O3/SOI wafers after oxygen plasma surface activation. X-ray photoelectron spectroscopy is employed to characterize the bonding interface before and after the wafer bonding process. It is found that oxides are formed on the bonding interface during bonding, which helps ensure high quality hydrophilic bonding.

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