“…In addition, the photolithography is only for 2D structures on a planar surface. For example, printing technologies, such as direct ink writing, [10][11][12][13][14] digital light processing (DLP), selective laser sintering (SLS), [15] fused deposition modeling (FDM), [16] and inkjet printing, [17] can be adapted to print 3D structures for a wide range of applications including electronic circuits, [18] batteries, [19] photonic structures, and optoelectronic devices. Thus, the optoelectronic devices with 3D structures need to be fabricated via stacks of 2D device layers, in which interconnects between layers are achieved using wire-bonding or a metal vial, [4] but the use of these layerby-layer stacking approaches can limit the geometries of devices that have more complex 3D shapes.…”