2013
DOI: 10.1002/pssc.201200566
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HVPE growth of GaN in the semipolar direction on planar Si(210)

Abstract: A layer of semipolar gallium nitride was grown on Si(210) substrate by hydride vapor phase epitaxy (HVPE). As a buffer a nanocrystalline layer of 3C‐SiC was used. It has been found that anisotropic strain of the growing nitride layer changed the crystallographic orientation of its surface: with increasing layer thickness orientation of the surface changed sequentially as follows: (0001), (10‐15), (10‐14), (10‐13) and, finally, (10‐12). (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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Cited by 7 publications
(1 citation statement)
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“…Limited by the expensive cost of homoepitaxial substrates, most GaN‐based devices are heteroepitaxially grown on foreign substrates, such as sapphire (Al 2 O 3 ), silicon (Si), silicon carbide (SiC), and gallium arsenide (GaAs). [ 9–11 ] However, heteroepitaxial growth of GaN crystal would generate internal stress during the growth process, which is bad for the manufacturing of high‐performance GaN‐based devices with reliability and long lifetime. What is more, with the increase of growth thickness, cracking problems may occur, which is helpless to the further growth of high‐quality, large‐sized GaN single crystal.…”
Section: Introductionmentioning
confidence: 99%
“…Limited by the expensive cost of homoepitaxial substrates, most GaN‐based devices are heteroepitaxially grown on foreign substrates, such as sapphire (Al 2 O 3 ), silicon (Si), silicon carbide (SiC), and gallium arsenide (GaAs). [ 9–11 ] However, heteroepitaxial growth of GaN crystal would generate internal stress during the growth process, which is bad for the manufacturing of high‐performance GaN‐based devices with reliability and long lifetime. What is more, with the increase of growth thickness, cracking problems may occur, which is helpless to the further growth of high‐quality, large‐sized GaN single crystal.…”
Section: Introductionmentioning
confidence: 99%