with semiconductor properties due to their bandgaps. Monolayer molybdenum disulfide (MoS 2 ), one of the TMDs, is found to have a direct bandgap of ≈1.8 eV, leading to low-power dissipation electronic devices, good carrier mobility (up to hundreds of cm 2 V −1 s −1 , a high current on/ off ratio (≈10 8 ), a steep subthreshold swing (74 mV decade −1 ), and atomically thin layered structure, suppressing short channel effects. [1][2][3][4][5][6][7][8][9] However, the metal-MoS 2 contact resistance is always to be several or ten thousands of Ω µm, which is more than 30 times larger than the Si-metal contact and even larger than the graphene-metal contact. [10][11][12][13][14][15][16][17][18][19][20][21][22] This high value of contact resistance will be one key factor to affect the MoS 2 based device performance to a great extent. Usually, the Fermi level pinning effect induced non-negligible Schottky barriers are considered to be responsible for the large contact resistance. [10,17] To reduce the contact resistance, ultrathin layers such as: graphene, Ta 2 O 5 , and hexagonal boron nitride (h-BN) are inserted at the MoS 2 /metal interface to attenuate the Fermi level pinning effect. [21][22][23][24][25] Benefiting from the lower Schottky barrier, the contact resistance of MoS 2 transistor can be reduced to 1.8 KΩ µm by introducing the inserting layer. [25] However, another kind of contact interface engineering method can further lower the contact resistance. For example, a chloride molecular treatment has been demonstrated to lower the contact resistance of MoS 2 transistor to 500 Ω µm. [26] On the other hand, formation of contacts to metallic-phase MoS 2 can reduce the contact resistance to 200-300 Ω µm. [27] Additionally, the clean graphene-MoS 2 interface with nickel-catalyzed etching graphene process can also reduce the contact resistance to 200 Ω µm. [28] These works suggest that other factors will affect the contact behavior of MoS 2 devices except the Fermi level pinning effect. Hence, understanding the intrinsic carrier transport of MoS 2 under metal contact is quite significant. Unfortunately, there have been few reports concentrating on this issue because of the difficulty to measure the electrical propriety of MoS 2 beneath the metal. Recently, we developed a modified transfer length method to realize the electrical property and carrier transport of 2D graphene film under the metal contact. [29][30][31] Through this method, the sheet resistances of MoS 2 both under metal contact (R SK ) and in channel (R SH ) are obtained through our An understanding of the charge transport of atomically thin molybdenum sulfide (MoS 2 ) beneath the metal electrode is important to the fabrication of high performance MoS 2 devices and circuits with low ohmic contact resistance. However, the carrier-transport mechanism in monolayer MoS 2 under the metal contact has remained elusive due to the difficulty of measuring the electrical properties of MoS 2 in contact regions. A method to distinguish the electrical properties of mon...