2022
DOI: 10.1021/acs.cgd.2c00683
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Hot-Wall MOCVD for High-Quality Homoepitaxy of GaN: Understanding Nucleation and Design of Growth Strategies

Abstract: Thick GaN layers with a low concentration of defects are the key to enable next-generation vertical power electronic devices. Here, we explore hot-wall metalorganic chemical vapor deposition (MOCVD) for the development of GaN homoepitaxy. We propose a new approach to grow high-quality homoepitaxial GaN in N2-rich carrier gas and at a higher supersaturation as compared to heteroepitaxy. We develop a low-temperature GaN as an optimum nucleation scheme based on the evolution and thermal stability of the GaN surfa… Show more

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Cited by 14 publications
(2 citation statements)
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References 54 publications
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“…Extensive research efforts dedicated to III-nitride semiconductors have led to the broad integration of GaN and AlN in contemporary optoelectronic and power electronic devices. Established growth methods for III-nitrides, such as metal–organic chemical vapor phase epitaxy (MOVPE), provide high-quality films; however, they rely on high growth temperatures and expensive precursors. In recent years, there has been an increasing focus on exploring alternative growth techniques to enable cost-effective and high-quality manufacturing of electronic devices for widespread applications. Magnetron sputter epitaxy (MSE) is an emerging technology that offers many advantages for device-quality III-nitride growth: cost-effectiveness, high-throughput, and ease of scalability.…”
Section: Introductionmentioning
confidence: 99%
“…Extensive research efforts dedicated to III-nitride semiconductors have led to the broad integration of GaN and AlN in contemporary optoelectronic and power electronic devices. Established growth methods for III-nitrides, such as metal–organic chemical vapor phase epitaxy (MOVPE), provide high-quality films; however, they rely on high growth temperatures and expensive precursors. In recent years, there has been an increasing focus on exploring alternative growth techniques to enable cost-effective and high-quality manufacturing of electronic devices for widespread applications. Magnetron sputter epitaxy (MSE) is an emerging technology that offers many advantages for device-quality III-nitride growth: cost-effectiveness, high-throughput, and ease of scalability.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, this is a balancing process. In addition, the GaN homogeneous epitaxy technology is not mature [17], with high cost and large trap state density. Therefore, the trapped electron in GaN layer is caused by both thermionic emission and trap assisted tunneling, which can increase the leakage current of vertical GaN-based diodes, and the breakdown voltage is limited [18].…”
Section: Introductionmentioning
confidence: 99%