2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2017
DOI: 10.1109/itherm.2017.7992525
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Hot spot removal in power electronics by means of direct liquid jet cooling

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Cited by 10 publications
(1 citation statement)
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“…Significant research works have been carried out using different active/passive cooling technologies, namely heat-pipe-assisted cooling, 7,8 thermoelectric cooling, 9 cooling using microchannels, 10,11 and the use of thermal conductivity enhancers, such as fins. 12 The success of these methods is dependent on the size of the device, cost-effectiveness, reliability, availability of technology, and ergonomics of the design. Passive cooling technologies are widely preferred due to zero parasitic power consumption, noise-free operation, and higher reliability compared to active cooling technologies.…”
Section: Introductionmentioning
confidence: 99%
“…Significant research works have been carried out using different active/passive cooling technologies, namely heat-pipe-assisted cooling, 7,8 thermoelectric cooling, 9 cooling using microchannels, 10,11 and the use of thermal conductivity enhancers, such as fins. 12 The success of these methods is dependent on the size of the device, cost-effectiveness, reliability, availability of technology, and ergonomics of the design. Passive cooling technologies are widely preferred due to zero parasitic power consumption, noise-free operation, and higher reliability compared to active cooling technologies.…”
Section: Introductionmentioning
confidence: 99%