Hot spot cooling in 3DIC package utilizing embedded thermoelectric cooler combined with silicon interposer

Li, Sheng-Liang; Hsu, Chung-Yen; Liu, Chun-Kai; Dai, Ming-Ji; Chien, Heng-Chieh; Tain, Ra-Min

doi:10.1109/impact.2011.6117280

Cited by 6 publications

(2 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…and localized cooling at hotspots [13] as they can be integrated into the heat spreader [14] or lid [15], embedded in the 2.5D/3D stacked chip package [16,17], or placed directly on the backside of the device [18]. Droplet-based cooling of electronic hotspots without external pumps has been demonstrated with the control of electrostatically actuated droplets, referred to as digital microfluidics using planar [19] or vertical integration [20,21] schemes.…”

Section: Introductionmentioning

confidence: 99%

Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics

Wei

Oprins

Cherman

et al. 2020

IEEE Trans. Compon., Packag. Manufact. Technol.

View full text Add to dashboard Cite

This work presents the design, fabrication, experimental characterization and modeling analysis of the chip level hotspot targeted liquid impingement jet cooling for high-power electronics. The hotspot targeted jet impingement cooling concept is successfully demonstrated with a chip-level jet impingement cooler with a 1 mm nozzle pitch and 300 µm nozzle diameter fabricated using high-resolution stereolithography (additive manufacturing). The CFD modeling and experimental analysis show that the improved hotspot targeted cooler design with fully open outlets can reduce the on-chip temperature difference by 70% compared with the full array cooler at the same pumping power of 0.03 W. The local heat transfer coefficient can achieve 15 × 10 4 W/m 2 K with a local flow rate per nozzle of 40 ml/min, requiring a pump power of 0.6 W. The benchmarking study proves that the hotspot targeted cooling is much more energy-efficient than uniform array cooling, with lower temperature difference and lower pump power.

show abstract

Section: Introductionmentioning

confidence: 99%

Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics

Wei

Oprins

Cherman

et al. 2020

IEEE Trans. Compon., Packag. Manufact. Technol.

View full text Add to dashboard Cite

show abstract

“…TEC devices can be utilized to control system temperature quickly and with high stability. [4][5][6] Typical uses of TECs are to maintain system temperatures under heat loads at a desired setpoint, such as in optical systems. However, the ability of TEC based systems to quickly change system temperature under low-heat load conditions allows for a stress-measure-stress system to incorporate accurate temperature variation during the testing phase without unduly increasing testing time.…”

Section: Dut Temperature Control Via Thermoelectric Coolingmentioning

confidence: 99%

Implementation and Design of a Novel Student Developed Modular HTOL/HTRB System Using Thermoelectric Control

O'Neal,

Porter,

Martino

2021 ASEE Virtual Annual Conference Content Access Proceedings

View full text Add to dashboard Cite

Addressing reliability issues is critical to the successful design and implementation of new semiconductor material systems proposed for next generation power electronic devices. For military systems, reliability is central to successful device designs, often outweighing other design factors. Several reliability testing schemes are central to validating power semiconductor device reliability. Of these, high temperature operating life (HTOL) and high temperature reverse bias (HTRB) testing are often used as go/no-go metrics for the success or failure of a fabricated lot of devices.To educate students in the importance of these testing regimens for devices, several undergraduate and graduate students have developed a custom, modular thermoelectrically cooled and controlled HTOL/HTRB system which allows for joint long term HTOL/HTRB testing at both institutions. Under constraints for cost, the system was designed to utilize a novel thermoelectric cooling scheme to provide a temperature range of 55 °C from 5 °C to 62 °C with less than 0.5 °C variation under 15 W heat load from devices-under-test (DUTs). A hermetic DUT environment was designed using nitrogen purging and active humidity sensing to control relative humidity (RH) within the environment to beneath 5% RH. Undergraduate students gained experience designing for manufacturability and machining with CAD tools not typically explored in typical electrical engineering design projects. An automated switch-matrix was designed and implemented to automate testing and allow for programming of complex stress-measure-stress reliability testing profiles. Control and automation were enabled using common Mbed processors used throughout an undergraduate electrical engineering curriculum. To accomplish a unified design which could be installed at multiple locations, students investigated and implemented a server rack mounted design which uses commonly available banana and BNC connections for "plug-and-play" of the system. A control program was developed using a LabVIEW program which managed the system wide control and programming of different reliability testing regimens, such as stress-measurestress, stepped-stress, and constant current, voltage, or power testing.Results for the fabricated system performance are shown demonstrating the successful achievement of the design metrics. To demonstrate the use of the system, results from recent undergraduate student-led HTOL testing on novel GaN Schottky diode parts are presented. Current and future senior capstone and masters-level research projects using the novel system are reviewed.

show abstract

Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5D integrated systems

Wei

Oprins

Cherman

et al. 2020

Applied Thermal Engineering

View full text Add to dashboard Cite

Hot spot cooling in 3DIC package utilizing embedded thermoelectric cooler combined with silicon interposer

Cited by 6 publications

References 9 publications

Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics

Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics

Implementation and Design of a Novel Student Developed Modular HTOL/HTRB System Using Thermoelectric Control

Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5D integrated systems

Contact Info

Product

Resources

About