Hot-pressed sintering of W/Cu functionally graded materials prepared from copper-coated tungsten powders

Tian, Peng; Feng, Yi; Meng, Xianglong; Zhao, Lei; Chengyu, Cai; Liu, Ke; Huang, Xiaochen

doi:10.1007/s12598-017-0939-0

Cited by 5 publications

(9 citation statements)

References 26 publications

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“…Gradation in CNT distribution over the sample cross-section in the obtained FGCM is shown in Figure 16. Three-layered W–Cu FGCMs with individual layer compositions of W–60 vol.-%Cu/W–40 vol.-% Cu/W–20 vol.-%Cu were fabricated by Tian et al [153]. Cu-coated W powders with different W contents produced by the electroless plating process were used as the starting powders.…”

Section: Manufacturing Methods Of Fgcmsmentioning

confidence: 99%

“…Several studies have carried out thermal conductivity measurements on FGCMs in recent years. These studies have predominantly been carried out on composites developed for potential application as PFCs in future fusion reactors [153,161,189,190]. Microwave sintering was shown to be an excellent method to fabricate W-Cu FGCMs with excellent thermal conductivity [161].…”

Section: Thermal Conductivitymentioning

confidence: 99%

“…W-Cu FGCM system was studied in [153,161]. While hot pressing was used for FGCM fabrication in [153], microwave sintering was used in [161]. Figure 59 shows that while the maximum achievable flexural strengths are similar in the two studies, the FGCM fabricated by microwave sintering displayed a much smaller range.…”

Section: Flexural Strengthmentioning

confidence: 99%

“…Figure 59 shows that while the maximum achievable flexural strengths are similar in the two studies, the FGCM fabricated by microwave sintering displayed a much smaller range. The significantly wider range observed in [153] can be attributed to several factors. First, the composition range of the developed FGCM was much smaller in [161], and this caused less variation.…”

Section: Flexural Strengthmentioning

confidence: 99%

“…Due to the higher thermal conductivity of copper, the thermal conductivity of the FGCM increased with increasing Cu content. Tian et al [153] measured the thermal conductivity of W-Cu FGCMs fabricated by hot pressing at different sintering temperatures. Lower conductivity values were obtained for the FGCMs fabricated at sintering temperatures higher than the melting point of copper.…”

Section: Thermal Conductivitymentioning

confidence: 99%

See 4 more Smart Citations

Review on developments of bulk functionally graded composite materials

Charan

Naik

Kota

et al. 2022

International Materials Reviews

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Monolithic components are often insufficient when a combination of conflicting properties, or a variation in properties at different regions within a material is required. Functionally graded composite materials (FGCM) are a relatively new class of materials with a systematic variation of the composition, microstructure, and properties along one direction. The graded structure offers tailorable property combinations not achievable with monolithic composites and significant recent research has been carried out on their development. An effort has been made in this article to review the latest developments on bulk FGCMs since 2015. The different processing techniques used for their fabrication have been discussed, highlighting their advantages, limitations, and recent advancements pertaining to FGCM fabrication. Various physical, mechanical, and thermal properties of FGCMs have been treated separately, and wherever possible, summary plots combining data from various research articles have been developed. Finally, potential areas for directing future FGCM research have been identified.

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Section: Manufacturing Methods Of Fgcmsmentioning

confidence: 99%

Section: Thermal Conductivitymentioning

confidence: 99%

Section: Flexural Strengthmentioning

confidence: 99%

Section: Flexural Strengthmentioning

confidence: 99%

Section: Thermal Conductivitymentioning

confidence: 99%

See 3 more Smart Citations

Review on developments of bulk functionally graded composite materials

Charan

Naik

Kota

et al. 2022

International Materials Reviews

View full text Add to dashboard Cite

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Recent Advances in W–Cu Composites: A Review on the Fabrication, Application, Property, Densification, and Strengthening Mechanism

Zhang,

Yang,

Huang

et al. 2023

Adv Eng Mater

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Tungsten–copper (W–Cu) composite is a pseudoalloy prepared by powder metallurgy method with tungsten and copper as the main components, which are widely used in electrical contacts, electrical discharge machining electrodes, electronic packaging, aerospace, and military fields due to its good conductivity, thermal conductivity, high melting point, high electrical breakdown strength, low contact resistance, high welding resistance, and high heat resistance. Herein, the recent advances of W–Cu composites are reviewed systematically. First, the preparative techniques of W–Cu composites are introduced in detail, and their advantages and disadvantages are evaluated objectively. Second, an introduction of the main application fields and corresponding characteristics advantages for W–Cu composites are provided. Subsequently, the densification techniques and strengthening mechanisms and their effects on microstructure, mechanical properties, and physical properties of W–Cu composites are mainly discussed. Finally, based on a comprehensive review of W–Cu composites, its future development trends and potential research challenges are summarized and prospected.

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Microstructure and properties of W Cu composites with low copper content at different sintering temperatures

Ding

Luo

et al. 2023

International Journal of Refractory Metals and Hard Materials

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Hot-pressed sintering of W/Cu functionally graded materials prepared from copper-coated tungsten powders

Cited by 5 publications

References 26 publications

Review on developments of bulk functionally graded composite materials

Review on developments of bulk functionally graded composite materials

Recent Advances in W–Cu Composites: A Review on the Fabrication, Application, Property, Densification, and Strengthening Mechanism

Microstructure and properties of W Cu composites with low copper content at different sintering temperatures

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