Hot hardness and indentation creep studies of a Fe–28Al–3Cr–0.2C alloy

Sharma, Garima; Ramanujan, R.V.; Kutty, T.R.G.; Tiwari, G.P.

doi:10.1016/s0921-5093(99)00590-0

Cited by 61 publications

(31 citation statements)

References 25 publications

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“…This reflected that the nanocomposite solder samples have a better creep resistance. Furthermore, it was observed that for both material system and at any maximum load, comparable [45][46][47]. In the present investigation, the n values ranged from 6.16 to 8.38 and this implied that the operative creep mechanism of SAC and SAC/Ni-CNT solder samples may be dislocation climb during the nanoindentation creep.…”

Section: Indentation Creep Of Sac and Its Nanocomposite Soldersupporting

confidence: 48%

Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes

Han

Jing

Nai

et al. 2011

J Mater Sci: Mater Electron

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In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 to 100 mN increased the percentage reduction in creep strain rate from 4 to 28%, for the composite compared to SnAgCu solder after 300 s of holding.

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Section: Indentation Creep Of Sac and Its Nanocomposite Soldersupporting

confidence: 48%

Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes

Han

Jing

Nai

et al. 2011

J Mater Sci: Mater Electron

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“…As in the case of Sn-Ag-Cu solder samples, during the nanoindentation tests, the Ag 3 Sn and Cu 6 Sn 5 particles present in the microstructure undergo coarsening during aging. 17 Furthermore, the indentation load and respective strains produce additional voids, 18 thus enhancing the diffusion rate of the elements present and accelerating the coarsening of the intermetallic compounds. In addition, the coarsened particles at high temperatures are considerably softer.…”

Section: Indentation Creep At Elevated Temperaturementioning

confidence: 99%

“…It is reported that diffusion creep, Harper-Dorn creep, and/or grain-boundary sliding are associated with n values within the range of approximately 1 to 2, 29 and dislocation climb is responsible for n values in the range of 4 to 6. 18 On the other hand, when n = 3, the ratecontrolling process may be dislocation glide. 18,29,30 In the present investigation, the range of n values of 3.7 to 7.4 implied that the operative creep mechanism for the Sn-Ag-Cu solder may be dislocation climb.…”

Section: Indentation Creep At Elevated Temperaturementioning

confidence: 99%

Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder

Han

Jing

Nai

et al. 2009

Journal of Elec Materi

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The creep behavior and hardness of Sn-3.5Ag-0.7Cu solder were studied using Berkovich depth-sensing indentation at temperatures of 25°C to 125°C. Assuming a power-law relationship between the creep strain rate and stress, an activation energy of 40 kJ/mol and stress exponents of 7.4, 5.5, and 3.7 at 25°C, 75°C, and 125°C, respectively, were obtained. The results revealed that, with increasing temperature, the creep penetration and steady-state creep strain rate increased whereas the stress exponent decreased. The stress exponent and activation energy results also suggested that the creep mechanism is dislocation climb, assisted by diffusion through dislocation cores in Sn. Furthermore, the hardness results exhibited a decreasing trend with increasing temperature, which is attributed to softening at high temperature.

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“…H -T data of the above mentioned alloy has been analysed in detail and results are reported elsewhere [26]. The indentation creep was studied by plotting a graph between hardness and dwell time at 843, 873, 903, 933 and 963 K (Fig.…”

Section: Resultsmentioning

confidence: 99%

Indentation creep studies of iron aluminide intermetallic alloy

Sharma¹,

Ramanujan

Kutty³

et al. 2005

Intermetallics

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Indentation creep behaviour of iron aluminide intermetallic (Fe-28Al -3Cr) was studied in the temperature range of 843 -963 K. The hardness and the plasticity parameter were also calculated from room temperature to 1273 K. The variation of hardness with time showed that the stress exponent ðnÞ was weakly dependent on temperature. Thermal activation parameter-activation area and energy were also calculated to identify the creep mechanism. The activation energy for high temperature creep was found to be in good agreement with that for selfdiffusion of pure iron and in excellent agreement with previous studies. These values of n, activation area and activation energy were found to be consistent with dislocation climb as the rate controlling creep mechanism. Conventional creep curves were also derived from hardness values.

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Hot hardness and indentation creep studies of a Fe–28Al–3Cr–0.2C alloy

Cited by 61 publications

References 25 publications

Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes

Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes

Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder

Indentation creep studies of iron aluminide intermetallic alloy

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