Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes

Abstract

In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 to 100 mN increased the percentage reduction in creep strain rate from 4 to 28%, for the composite compared to SnAgCu solder after 300 s of holding.

Improved microstructure and mechanical properties for Sn58Bi solder alloy by addition of Ni-coated carbon nanotubes

“…7(a) shows the nanoindentation load-depth curves of the pure and composite solder alloy. There are no steps and discontinuities on the curves, which suggest that no cracks and fractures occur during the nanoindentation process [26,27]. As the Ni-CNTs wt% increases, the creep penetration depth decreases initially and then increases, the smallest penetration depth is in the SnBi-0.05CNT solder alloy.…”

“…For nanoindentation, the creep strain rate and creep stress exponent get from a power law creep equation [28,29]. Based on the curves (shown in Fig.…”

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

“…In the studies of Han et al , the addition of 0.05 wt% of Ni-CNTs into SAC solder has shown the most pronounced enhancement in terms of solder properties. The composite solder has higher strength, lower CTE [118], better creep performance [121], and better corrosion resistance [122]. Yang et al [123] reported that Ni-CNT added solder joint has better electromigration resistance as the atomic diffusion induced by electromigration in the solder is retarded by Ni-coated CNT single strands or clusters.…”

Mechanics of Metal-Nanocomposites at Multiple Length Scales: Case of Al-BNNT

“…Recent developments in manufacturing technology have led to a surge of interest in developing metal-nanocomposites (Bakshi et al 2010;Camargo et al 2009;He et al 2009;George et al 2005;Pogrebnjak et al 2014), with the primary goal of improving strength and stiffness. Moreover, reinforcing metal with nanotubes can improve the resistance to creep (Han et al 2012), thermal elongation (Camargo et al 2009), and fracture (Kim et al 2007). Although a number of experimental studies have reported on metal-nanocomposites, there are very few reported analytical and computational studies.…”