2015
DOI: 10.1117/12.2176006
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Holographic contouring and its limitations in nearly specularly reflecting surface measurement

Abstract: The applicability of the digital holography to grinded surfaces shape measurements is experimentally examined with regard to the surface micro-roughness of brittle materials (optical glass). Multi-wavelength phase shifted digital holographic interferometry (holographic contouring) is used and its performance is analyzed. Holographic contouring is a great candidate for the precise shape measurement technique, which can be applied to the iterative manufacture process of optical elements. Optical surface artifact… Show more

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Cited by 5 publications
(2 citation statements)
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“…This modulation is directly correlated with the correlation of the two speckle wave fields E 1 (z) and E 2 (z). Generally, the speckle CC between two speckle fields is calculated to describe this modulation, which will also be used in our paper; the standard speckle CC γ(z) corresponding to different reconstruction dis tances can be expressed as [16]…”
Section: Cc-based Auto-focusing Algorithmmentioning
confidence: 99%
“…This modulation is directly correlated with the correlation of the two speckle wave fields E 1 (z) and E 2 (z). Generally, the speckle CC between two speckle fields is calculated to describe this modulation, which will also be used in our paper; the standard speckle CC γ(z) corresponding to different reconstruction dis tances can be expressed as [16]…”
Section: Cc-based Auto-focusing Algorithmmentioning
confidence: 99%
“…There is a vast field of applications of DHI and other interference based methods including: entertainment display [8], imaging heat transfer and mass transfer [7,[9][10][11][12][13], research in free convection [14,15], visualization of the 3D velocity vector field in turbulent boundary layer [6], analysis of supersonic jets [6], biological (living cell imaging) [6,16], environmental applications [6,17], precision measurements [8,18,19], small displacements [20], thermomechanical analysis and non-destructive testing [6], microscopy and high-resolution volume imagery [21,22], vibrometry [23,24], topography [25,26], process monitoring [7], computerized tomography [7,27], and so on. This paper aims at investigating heat transfer problems.…”
Section: Introductionmentioning
confidence: 99%