History of Embedded and Fan‐Out Packaging Technology

Topper, Michael J.; Ostmann, A.; Braun, T.; Lang, Klaus‐Dieter

doi:10.1002/9781119313991.ch1

Cited by 3 publications

(1 citation statement)

References 15 publications

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“…However, pure epoxy resins have a tendency for warpage during the curing process, leading to some failure problems for the whole chip fabrication. In order to overcome this problem, the following two ways are used: one is that a larger number of silica fillers are introduced to the pure epoxy resins to reduce the volume shrinkage during the curing process and the other is that some new chemical structure is designed to decrease the volume shrinkage . The abovementioned ways can solve these problems, but there is a huge challenge that the adhesion force between copper and the epoxy resin composite is very poor, leading to some serious problems during the manufacturing process of chip substrates .…”

Section: Introductionmentioning

confidence: 99%

Curing Kinetics and Mechanical Properties of Epoxy–Cyanate Ester Composite Films for Microelectronic Applications

Ding,

Fang,

et al. 2023

ACS Omega

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In general, although abundant literature studies are available on epoxy resin systems, a complete description of the curing kinetics in epoxy–cyanate ester composites relevant to the microelectronics industry is still lacking. Herein, curing behaviors of Ajinomoto build-up films, which are epoxy/silica composites, were studied by the non-isothermal differential scanning calorimetry method, and then, three non-isothermal curing kinetics models and model-free curing methods were used to analyze curing behaviors. In addition, a copper layer was also deposited onto the surface of the build-up film, and its interfacial adhesion property was also analyzed at different pre-curing conditions. The results showed that the curing reaction of the build-up film contains two curing reaction processes, and the first curing process is suited for the autocatalytic curing model, while the other curing process is suited for the Kamal curing kinetics model. Three model-free curing methods were used to calculate the activating energy at different degrees of curing, which indicated that the activating energy is variable during the whole curing process. The interfacial adhesion strength between the build-up film and copper layer decreased with the increase in the degree of curing, which is attributed to the contribution of mechanical anchoring. This work will offer guidance in curing behaviors for improving interfacial bonding force and controlling warpage behavior for chip substrates in the future.

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Section: Introductionmentioning

confidence: 99%

Curing Kinetics and Mechanical Properties of Epoxy–Cyanate Ester Composite Films for Microelectronic Applications

Ding,

Fang,

et al. 2023

ACS Omega

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Panel‐Level Packaging for Heterogenous Integration

Topper¹,

Braun²,

Billaud³

et al. 2021

Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces

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High Heat Resistant Peelable Temporary Bonding Film and New Debonding System with Xe Flash Light Irradiation

Akasu

Miyazawa

Enomoto

et al. 2020

International Symposium on Microelectronics

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We have developed a new temporary bonding film (TBF) and new debonding system with Xe flash light irradiation, named photonic release system, for advanced package assembly process. Since new TBF has a high Tg over 200 °C after curing and shows good chemical resistance to developer, resist stripper, and plating chemicals, no delamination, voiding, and swelling were observed after thermal and chemical treatment in the bonded structure of wafer and glass carrier. In addition, by adopting a metal-sputtered glass carrier, wafer could be debonded by Xe flash light irradiation in less than 1 ms through the glass carrier with no damage. Residual TBF on the wafer surface could be peeled off smoothly at ambient temperature without residue on the wafer. In this research, we also demonstrated the good applicability of this temporary bonding film to the typical packaging process by using test vehicle including 12 inch mold wafer and the advantage of photonic release system.

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History of Embedded and Fan‐Out Packaging Technology

Cited by 3 publications

References 15 publications

Curing Kinetics and Mechanical Properties of Epoxy–Cyanate Ester Composite Films for Microelectronic Applications

Curing Kinetics and Mechanical Properties of Epoxy–Cyanate Ester Composite Films for Microelectronic Applications

Panel‐Level Packaging for Heterogenous Integration

High Heat Resistant Peelable Temporary Bonding Film and New Debonding System with Xe Flash Light Irradiation

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