Highly thermally conductive SiO2-coated NFC/BNNS hybrid films with water resistance

Song, Na; Wang, Qi; Jiao, Dejin; Pan, Haidong; Shi, Liyi; Ding, Peng

doi:10.1016/j.compositesa.2020.106261

Cited by 25 publications

(12 citation statements)

References 56 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Although it was higher than that of AlN/PI thermally conductive composite films under the same amount of fillers (105 MPa), it was still significantly lower than that of the pure PI films (145 MPa). As can be seen, PI-based thermally conductive composite films prepared by the filling strategy often require the addition of a large amount of thermally conductive fillers to obtain desirable thermal conductivities, − inevitably resulting in a decrease in the mechanical and processing properties, which limits their wider application. , Furthermore, studies have shown that when the λ ratio of the polymer matrix to the thermally conductive fillers is less than 0.01, it is difficult to efficiently improve the thermal conductivities of the composites by simply filling them with highly thermally conductive fillers alone, that is, novel kinds of polymer matrix with high intrinsic thermal conductivities need to be designed and fabricated. − …”

Section: Introductionmentioning

confidence: 99%

Liquid Crystalline Polyimide Films with High Intrinsic Thermal Conductivities and Robust Toughness

2021

View full text Add to dashboard Cite

Low intrinsic thermal conductivity coefficients (λ) of polyimide (PI) films limit their application in heat-prone flexible electronics. By optimizing the liquid crystal range to fit the curing temperature, novel kinds of intrinsically highly thermally conductive liquid crystalline PI (LC-PI) films are fabricated. When the molar ratio of 4,4′-diaminodiphenyl ether (ODA) to 1, 4-bis(4-aminophenoxy)benzene (TPE-Q) is 1:3 (sample no. IV), liquid crystal range of preLC-PIIV films is 272∼388 °C, including curing temperature of 350 °C. The LC-PIIV films cured in liquid crystal range retain liquid crystal texture to room temperature, and the in-plane λ (λ∥) and through-plane λ (λ⊥) at room temperature reach 2.11 W/(m·K) and 0.32 W/(m·K), respectively, significantly higher than λ∥ (0.77 W/(m·K)) and λ⊥ (0.15 W/(m·K)) of LC-PII films which are cured out of the liquid crystal range. Meanwhile, LC-PIIV films possess excellent mechanical and thermal properties, showing application prospects in high-heating flexible electronics.

show abstract

Section: Introductionmentioning

confidence: 99%

Liquid Crystalline Polyimide Films with High Intrinsic Thermal Conductivities and Robust Toughness

2021

View full text Add to dashboard Cite

show abstract

“…Table 5 shows the summary of thermally conductive ceramic/polymer composite with high in-plane k . The ceramic/polymer composite films with high in-plane k and excellent insulating performance have been fabricated by many methods, including doctor blading [ 141 ], hot compression [ 142 ], solvent casting [ 143 ] and vacuum filtration [ 144 ]. Specifically, as shown in Fig.…”

Section: High-performance Thermally Conductive Filmsmentioning

confidence: 99%

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

et al. 2022

View full text Add to dashboard Cite

Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed.

show abstract

“…The honeycomb structure perpendicular to lamellar alignment can store large compressive strains by bending or folding under external stress, and then recover in virtue of the stored elastic strain energy and repulsive forces between polysiloxane methyl groups (Xiao et al 2022;Zhang et al 2019). It is noteworthy that the compression strength of CNF/BNNS aerogel in both directions decreases slightly in relation to pure CNF aerogel, which is attributed to the fact that the incorporation of a small amount of BNNS destroys the structural integrity of CNF to a certain extent (Song et al 2021). When the silylated CNF is combined with different amounts of BNNS, the compressive strength and elastic recovery of aerogel are signi cantly improved.…”

Section: Mechanical Properties Of the Anisotropic Si-cnf/bnns Aerogelmentioning

confidence: 99%

Directional fabricating of flexible and compressible cellulose nanofibril composite aerogel with excellent thermal insulation, flame-retardancy and radiative cooling for efficient thermal management

Zhao

Zhou

et al. 2022

Preprint

View full text Add to dashboard Cite

In order to reduce the thermal discomfort and fire accidents caused by overheating of electronics and high temperature of buildings, high-performance thermal insulation and fire-resistant materials are urgently desirable. Cellulose nanofiber aerogel derived from regenerative resources holds wide promise in the field of thermal insulation, but its inherent flammability, poor mechanical strength and water resistance make it face great challenges in practical application. Herein, a lightweight, porous, anisotropic silylated cellulose nanofiber/hydroxylated boron nitride nanosheet (Si-CNF/BNNS) composite aerogel was prepared by unidirectional freeze-casting technique. Attributed to the aligned structure, Si-CNF/BNNS aerogel was robust axially and compressible radially. The thermal conductivity of aerogel was 0.0621 W·m−1·K−1 in the axial direction and 0.0339 W·m−1·K−1 in the radial direction, demonstrating an anisotropic thermal insulation performance. In addition, aerogel also exhibited excellent flame retardant, hydrophobic and radiative cooling properties, as evidenced by extremely low peak heat release rate of 14.05 kW/m2, water contact angle of 136.6° and high solar reflectivity. This high-performance anisotropic Si-CNF/BNNS aerogel is promising in improving thermal comfort and environmental safety, showing its great potential in electronic packaging and energy efficient buildings.

show abstract

Highly thermally conductive SiO2-coated NFC/BNNS hybrid films with water resistance

Cited by 25 publications

References 56 publications

Liquid Crystalline Polyimide Films with High Intrinsic Thermal Conductivities and Robust Toughness

Liquid Crystalline Polyimide Films with High Intrinsic Thermal Conductivities and Robust Toughness

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

Directional fabricating of flexible and compressible cellulose nanofibril composite aerogel with excellent thermal insulation, flame-retardancy and radiative cooling for efficient thermal management

Contact Info

Product

Resources

About