Highly-stable silver nanobelts joined via diffusion-free attachment

Abstract

Silver nanobelts are demonstrated here to undergo inter-particle joining at relatively low temperatures of less than 180 °C. For surface-coated networks of nanobelts this joining reduced the network sheet resistance by 95%. The joining mechanism appears to be non-diffusional oriented attachment, caused by the thermal reactivation of the halted oriented attachment mechanism that occurred originally at room temperature during the rapid nanobelt synthesis. This self-assembly mechanism was explored by in situ electrical and calorimetric experiments, and supported by electron microscopy. Unlike pentagonal silver nanowires, silver nanobelts do not rely on diffusional instability to achieve workably low joining temperatures. The oriented attachment displayed by nanobelts represents a new approach to achieving valuable reductions in network resistance, disentangled from the instability and diffusion-driven failure by nanoparticle degradation displayed by competing silver nanoparticles.

Stretchable Platinum Network-Based Transparent Electrodes for Highly Sensitive Wearable Electronics

“…As known, networks with belt‐like geometry show excellent optical transmittance and durable flexibility due to their unique structural anisotropy . For example, a free‐standing paper‐like film with a large size geometry used in energy storage displays an excellent average transmittance of 90% in the visible region .…”

Real time resistance monitoring during sintering of silver paste

“…and/or monitored with a slow sampling rate [12]. Some studies [3,[11][12][13][14] have missing resistance values because of the range limit of the technology applied. For example in [3], the maximum measurable resistance was 100 MΩ for the method used.…”

“…Some studies [3,[11][12][13][14] have missing resistance values because of the range limit of the technology applied. For example in [3], the maximum measurable resistance was 100 MΩ for the method used. When monitoring the ICA specimen resistance during curing, it exceeded the limit of 100 MΩ before the temperature reached 90 °C, and valid data was therefore not detected.…”

“…In this work, we study the sintering process of silver paste with an improved real time resistance monitoring technology based on the method used previously for a solder reflow study [18]. We present a larger range of resistance measurement (10 -5 -10 11 Ω), and provide a more continuous measurement than previous methods [3,5,10].…”

“…[1] Some SSPs have lower bonding temperature than most solders, and can survive a higher temperature than some solder joints once bonded [1]. In some work [2][3][4], SSPs are added to epoxy based isotropically conductive adhesives (ICAs) to adjust the material property such as the conductivity.…”